产品概要
描述
该电源模块采用了以意法半导体第三代技术为代表的最新碳化硅MOSFET技术成果，在带有NTC和电容的ACEPACK 2模块中实现了三路升压和半桥拓扑。用户可凭借这种模块化解决方案打造可满足极高功率密度和效率要求的复杂拓扑结构。
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性能一览
- ACEPACK 2电源模块
- 典型RDS(on)为49 mΩ的三路升压开关
- 典型RDS(on)为23.5 mΩ的半桥开关
- 绝缘电压2.5 kVrms
- 集成NTC温度传感器
- 集成直流链路电容器
- 基于DBC Cu-Al2O3-Cu
- 压合式接触引脚
- ACEPACK 2电源模块
特别推荐
EDA Symbols, Footprints and 3D Models
STMicroelectronics - A2TBH45M65W3-FC
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Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| A2TBH45M65W3-FC | Active 产品已量产 | ACEPACK 2 | Industrial | Ecopack1 | - | - | |
A2TBH45M65W3-FC
Package:
ACEPACK 2Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A2TBH45M65W3-FC | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
A2TBH45M65W3-FC Active
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