产品概述
描述
TSV7721、TSV7722和TSV7723是单、双通道22 MHz带宽的单位增益稳定放大器。室温下，最大输入偏移电压为200 µV（典型值为50 µV），针对接近接地的共模进行了优化，使得TSV772x成为低边电流测量的理想选择。
TSV772x可在1.8 V至5.5 V的单电源下工作，并完全指定负载为47 pF，因此可轻松用作模数转换器的输入缓冲器。
TSV772x系列提供轨到轨输出，具有出色的速度/功耗比和22 MHz增益带宽积，并且在5 V时仅消耗1.7 mA电流。
该器件还具有超低的输入偏置电流，可与将电流作为测量关键值的光电二极管和其他传感器连接。
这些特性使TSV772x系列成为高精度、大带宽传感器接口的理想选择。
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所有功能
- 增益带宽积22 MHz，单位增益稳定
- 高精度输入偏移电压：典型值为50 µV，最大值为200 µV。
- 低输入偏置电流：2 pA（典型值）。
- 低输入电压噪声密度：7 nV/√Hz
- 宽电源电压范围：1.8 V至5.5 V
- 轨到轨输出
- 输入共模范围包括低轨
- 提供汽车级和关断版本
- 优势：
- 高频信号调节
- 优化的低侧电流感应精度
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
Power Management Design Center
Thermal-electrical Simulators for Components
Signal Conditioning Design Tool
NFC/RFID Calculators
Choose design tool: 
Power Management Design Center
Power Supply Design Tool
• SMPS design, by topology, by type and by product
• PFC design with analog and digitial control
• Supports various PCB configurations
Choose type: DC/DC AC/DC 太阳能电池充电器
Power Management Design Center
LED Lighting Design Tool
• Handles AC-DC and DC-DC design in common topologies
• Displays interactive and annotated schematic
• Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data
Choose type: DC/DC AC/DC
Power Management Design Center
Digital Power Workbench
• Provides a step-by-step optimized design of power section and control loop
• Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs
Power Management Design Center
Power Tree Designer
• Specify input/output power for each node in the tree
• Check for consistency
• Design each individual node
Choose design tool: 
Thermal-electrical Simulators for Components
AC Switches Simulator
• Select ratings and application waveforms
• Get junction temperature and blocking voltage graphs
• Search and sort suitable devices
Thermal-electrical Simulators for Components
Rectifier Diodes Simulator
• Select ratings and application waveforms
• Estimate power losses
• Search and sort suitable devices
Thermal-electrical Simulators for Components
STPOWER Studio
• Supports long mission profiles
• Provides power loss and temperature graphs
• Helps define heatsink thermal properties
Thermal-electrical Simulators for Components
Twister Sim
• Help select the right ViPOWER Automotive power device
• Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis
• Supports various PCB configurations
Thermal-electrical Simulators for Components
TVS Simulator
• Specify system ratings and surge waveform
• Search and sort suitable devices
Thermal-electrical Simulators for Components
Estimate
• Build simple schematics and firmware inputs in minutes
• Quickly generate reliable estimates of battery life, system power consumption and bill of materials costs
Choose design tool: 
Signal Conditioning Design Tool
Active Filters
• Handles multi-stage-designs and common topologies
• Returns circuit component values
• Provides gain, phase and group delay graphs
• Low Pass, High Pass and Band Pass
Signal Conditioning Design Tool
Comparators
• Handles most common configurations
• Returns circuit components values
• Provides I/O signal waveforms
• Inverting, Non Inverting, Window
Signal Conditioning Design Tool
Low side Current Sensing
• Returns circuit component values
• Provides current error graphs
Signal Conditioning Design Tool
High side Current Sensing
• Provides current error graphs.
• Help to select the right High side current sensing and shunt devices.
Choose design tool: 
NFC/RFID Calculators
NFC Inductance
• Input geometry and substrate properties
• Get antenna impedance
NFC/RFID Calculators
UHF Link Budget
• Enter forward and reverse link characteristics
• The tool returns link budget estimate
NFC/RFID Calculators
NFC Tuning Circuit
• Enter antenna parameter and matching target
• Select the topology of the matching network
• The tool returns component values for the desired design targets
特别推荐
EDA符号、封装和3D模型
意法半导体 - TSV7722
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
所有资源
| 资源标题 | 版本 | 更新时间 |
|---|
SPICE models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 24 Mar 2021 | 24 Mar 2021 |
Eldo models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 24 Mar 2021 | 24 Mar 2021 |
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV7722IDT | 批量生产 | SO-8 | 工业 | Ecopack3 | |
| TSV7722IQ2T | 批量生产 | QFN-8L P 0.5 mm | 工业 | Ecopack3 | |
| TSV7722IST | 批量生产 | MiniSO-8 | 工业 | Ecopack3 | |
| TSV7722IYDT | 批量生产 | SO-8 | 汽车应用 | Ecopack3 | |
| TSV7722IYST | 批量生产 | MiniSO-8 | 汽车应用 | Ecopack3 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | 等级规格 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||
| TSV7722IYDT | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| TSV7722IQ2T | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| TSV7722IYST | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| TSV7722IDT | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| TSV7722IST | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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TSV7722IYDT 批量生产
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TSV7722IQ2T 批量生产
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TSV7722IYST 批量生产
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TSV7722IDT 批量生产
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TSV7722IST 批量生产
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distributors
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包:
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