产品概述
描述
The PM7060 is an integrated power stage solution optimized for synchronous buck applications to offer high current, high efficiency, and high power density performance. Packaged in 5x6 mm QFN package, the PM7060 enables voltage regulator design to deliver in excess of 60 A per phase current. The internal power MOSFETs utilize state-of-the-art technology that delivers industry benchmark performance to significantly reduce switching and conduction losses.
The PM7060 incorporates an advanced MOSFET gate driver IC that features high current driving capability, adaptive deadt-time control, and integrated bootstrap switch, a thermal monitor that alerts the system of excessive junction temperature. This driver is compatible with 3.3 V logic PWM with tri-state to manage High Impedance Output. Diode emulation mode can be enabled at light loads through the use of GLCTRL signal.
The device also integrates a current monitor to provide a real-time scale down of inductor current (IMON). A temperature monitor provides the system with an indication of the power stage internal temperature (TMON) and can be used to throttle the system operation down to a safer level if needed.
The device also integrates fault alerts such as HS FET overcurrent, overtemperature and HS MOSFET short failures.
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所有功能
- Thermally enhanced QFN 5x6 41L package
- Optimized MOSFET switching performance with integrated Schottky diode in LS MOSFET
- Up to 60 A continuous current
- High frequency operation up to 2 MHz
- Power MOSFETs optimized for 12 V input stage and 10% to 15% duty cycle operation
- 3.3 V PWM logic with tri-state and hold-off
- PWM minimum controllable on-time of 30 ns
- Diode emulation mode at light loads for high efficiency over the full load range using GLCTRL pin
- Low PWM propagation delay (< 20 ns)
- Current sense monitor (IMON)
- Temperature monitor (TMON)
- Overtemperature alert
- HS MOSFET overcurrent and short alert
- Undervoltage lockout for VDRV
- Material categorization: for definitions of compliance
EDA符号、封装和3D模型
意法半导体 - PM7060
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| PM7060TR | 建议 | - | 工业 | - | - | - | |
PM7060TR
Package:
-Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PM7060TR | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
PM7060TR 建议