MASTERGAN7

批量生产
Design Win

650 V enhancement mode GaN High power density half-bridge with high voltage driver

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产品概述

描述

The MASTERGAN7 is an advanced power system-in-package integrating two enhancement mode GaN transistors in a half-bridge configuration driven by a high-voltage, high frequency gate driver.

The integrated power GaNs have typical RDS(ON) of 270 mΩ and 650 V drain source blocking voltage.

The MASTERGAN7 features linear regulators on both the lower and upper driving sections to optimize driving efficiency. The high side of the embedded gate driver can be supplied by the integrated bootstrap diode. The interlocking function avoids cross-conduction conditions.

The advanced driver section, thanks to small propagation delay, very short wake-up time, and short, minimum on-times, enables high frequency switching operation.

The extended range of input pins as well as the remote signaling pin (FLT) allow easy interfacing with controllers, microcontrollers, or DSP units. The standby pin allows to reduce the power consumption of the device during inactive periods.

The MASTERGAN7 operates in the industrial temperature range, -40 °C to 125 °C.

The device is available in a compact 9x9x1 mm QFN package.

  • 所有功能

    • Power system-in-package integrating 650 V GaN transistors half-bridge with high-voltage gatedriver
    • 270 mΩ typ low-side and high-side RDS(ON) with IDS(MAX) = 6 A
    • Linear regulators to regulate high-side and low-side driver supply voltage
    • Overall driver’s propagation delay of 45 ns and 35 ns minimum pulse
    • Very fast wake-up time of high-side driver
    • Externally adjustable turn-on resistors
    • UVLO protection on VCC and high-side driver supply voltage
    • Interlocking function
    • Dedicated pins for standby and shutdown with fault pin for remote signal
    • 3.3 V to 15 V (typ.) compatible inputs with hysteresis and pull-down
    • Thermal shutdown protection

EDA符号、封装和3D模型

意法半导体 - MASTERGAN7

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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封装

3D model

3D模型

质量与可靠性

料号 Marketing Status 等级规格 符合RoHS级别 Longevity Commitment Longevity Starting Date 材料声明**
MASTERGAN7TR
批量生产
TFQFPN 9X9X1.05 35L PITCH 0.6MM 工业 Ecopack2 - -

MASTERGAN7TR

Package:

TFQFPN 9X9X1.05 35L PITCH 0.6MM

Material Declaration**:

Marketing Status

批量生产

Package

TFQFPN 9X9X1.05 35L PITCH 0.6MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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MASTERGAN7TR
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经销商的可用性 MASTERGAN7TR

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MASTERGAN7TR 批量生产

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MASTERGAN7TR

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商