产品概述
描述
The LSM6DSV16B is a system-in-package inertial measurement unit (IMU) featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with dual channels for processing acceleration and angular rate sensing data for motion tracking (user interface, device power management, 3D head tracking for gaming and an enhanced audio experience) as well as vibration detection for bone conduction on separate channels with dedicated configuration, processing, and filtering.
The motion tracking in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience.
The LSM6DSV16B embeds advanced dedicated features and data processing for motion processing like the finite state machine (FSM), sensor fusion low power (SFLP), and adaptive self-configuration (ASC).
The LSM6DSV16B integrates a 6-axis IMU sensor with audio accelerometer features in a compact package (2.5 x 3.0 x 0.71 mm).
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所有功能
- Dual channels for motion tracking and bone conduction
- Power consumption: 0.95 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 4.5 KB
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000/±4000 dps full scale
- 3-axis audio accelerometer with flat and wide bandwidth > 1 kHz and low noise 20 μg /√Hz
- SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
- TDM slave interface
- Advanced pedometer, step detector, and step counter
- Significant motion detection, tilt detection
- Standard interrupts: free-fall, wakeup, 6D orientation, click and double-click
- Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
- Embedded adaptive self-configuration (ASC)
- Embedded sensor fusion low-power algorithm
- Embedded temperature sensor
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (extended range: 1.08 V to 3.6 V)
- Compact footprint: 2.5 mm x 3 mm x 0.71 mm
- ECOPACK and RoHS compliant
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EDA符号、封装和3D模型
意法半导体 - LSM6DSV16B
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| LSM6DSV16B | 预览 | LGA 14L 2.5x3x0.74 mm | Ecopack2 | |
| LSM6DSV16BTR | 批量生产 | LGA 14L 2.5x3x0.74 mm | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| LSM6DSV16BTR | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
| LSM6DSV16B | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
LSM6DSV16BTR 批量生产
LSM6DSV16B 预览