LSM6DSV16B

批量生产
Design Win

6-axis IMU with sensor fusion and hearable features for TWS

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产品概述

描述

The LSM6DSV16B is a system-in-package inertial measurement unit (IMU) featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with dual channels for processing acceleration and angular rate sensing data for motion tracking (user interface, device power management, 3D head tracking for gaming and an enhanced audio experience) as well as vibration detection for bone conduction on separate channels with dedicated configuration, processing, and filtering.

The motion tracking in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience.

The LSM6DSV16B embeds advanced dedicated features and data processing for motion processing like the finite state machine (FSM), sensor fusion low power (SFLP), and adaptive self-configuration (ASC).

The LSM6DSV16B integrates a 6-axis IMU sensor with audio accelerometer features in a compact package (2.5 x 3.0 x 0.71 mm).

  • 所有功能

    • Dual channels for motion tracking and bone conduction
    • Power consumption: 0.95 mA in combo high-performance mode
    • “Always-on" experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 4.5 KB
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000/±4000 dps full scale
    • 3-axis audio accelerometer ​with flat and wide bandwidth > 1 kHz ​ and low noise 20 μg /√Hz
    • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
    • TDM slave interface
    • Advanced pedometer, step detector, and step counter
    • Significant motion detection, tilt detection
    • Standard interrupts: free-fall, wakeup, 6D orientation, click and double-click
    • Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
    • Embedded adaptive self-configuration (ASC)
    • Embedded sensor fusion low-power algorithm
    • Embedded temperature sensor
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (extended range: 1.08 V to 3.6 V)
    • Compact footprint: 2.5 mm x 3 mm x 0.71 mm
    • ECOPACK and RoHS compliant

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EDA符号、封装和3D模型

STMicroelectronics - LSM6DSV16B

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质量与可靠性

产品型号 Marketing Status 符合RoHS级别 材料声明**
LSM6DSV16B
预览
LGA 14L 2.5x3x0.74 mm Ecopack2
LSM6DSV16BTR
批量生产
LGA 14L 2.5x3x0.74 mm Ecopack2

LSM6DSV16B

Package:

LGA 14L 2.5x3x0.74 mm

Material Declaration**:

PDF XML

Marketing Status

预览

Package

LGA 14L 2.5x3x0.74 mm

RoHS Compliance Grade

Ecopack2

LSM6DSV16BTR

Package:

LGA 14L 2.5x3x0.74 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

LGA 14L 2.5x3x0.74 mm

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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LSM6DSV16BTR
Available at distributors

经销商的可用性 LSM6DSV16BTR

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LSM6DSV16B
Available at distributors

经销商的可用性 LSM6DSV16B

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ECCN (US):
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LSM6DSV16BTR

Operating Temperature (°C)

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LSM6DSV16B 预览

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-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

LSM6DSV16B

Operating Temperature (°C)

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Max:

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商