产品概述
描述
The STM32N6570-DK Discovery kit is a complete demonstration and development platform for the Arm® Cortex®‑M55 core‑based STM32N657X0H3Q microcontroller.
The STM32N6570-DK Discovery kit includes a full range of hardware features that help the user evaluate many peripherals, such as USB Type-C®, Octo‑SPI flash memory and Hexadeca‑SPI PSRAM devices, Ethernet, camera module, LCD, microSD™, audio codec, digital microphones, ADC, flexible extension connectors, and user button. The four flexible extension connectors feature easy and unlimited expansion capabilities for specific applications such as wireless connectivity, analog applications, and sensors.
The STM32N657X0H3Q microcontroller features one USB 2.0 high‑speed/full‑speed Device/Host/OTG controller, one USB 2.0 high‑speed/full‑speed Device/Host/OTG controller with UCPD (USB Type-C® Power Delivery), one Ethernet with TSN (time-sensitive networking), four I2Cs, two I3Cs, six SPIs (of which four I2S‑capable), two SAIs, with four DMIC support, five USARTs, five UARTs (ISO78916 interface, LIN, IrDA, up to 12.5 Mbit/s), one LPUART, two SDMMCs (MMC version 4.0, CE-ATA version 1.0, and SD version 1.0.1), three CAN FD with TTCAN capability, JTAG and SWD debugging support, and Embedded Trace Macrocell™ (ETM).
The STM32N6570-DK Discovery kit integrates an STLINK-V3EC embedded in-circuit debugger and programmer for the STM32 MCU, with a USB Virtual COM port bridge and the comprehensive MCU Package.
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所有功能
- STM32N657X0H3Q Arm® Cortex®‑M55‑based microcontroller featuring ST Neural-ART Accelerator, H264 encoder, NeoChrom 2.5D GPU, and 4.2 Mbytes of contiguous SRAM, in a VFBGA264 package
- 5" LCD module with capacitive touch panel
- USB Type-C® with USB 2.0 HS interface, dual‑role‑power (DRP)
- USB Type-A with USB 2.0 HS interface, host, 0.5 A max
- 1‑Gbit Ethernet with TSN (time-sensitive networking) compliant with IEEE‑802.3‑2002
- SAI audio codec
- One MEMS digital microphone
- 1‑Gbit Octo‑SPI flash memory
- 256-Mbit Hexadeca‑SPI PSRAM
- Two user LEDs
- User, tamper, and reset push-buttons
- Board connectors:
- USB Type-C®
- USB Type-A
- Ethernet RJ45
- Camera module
- microSD™ card
- LCD
- Stereo headset jack including analog microphone input
- Audio MEMS daughterboard expansion connector
- ARDUINO® Uno R3 expansion connector
- STMod+ expansion connector
- On-board STLINK-V3EC debugger/programmer with USB re-enumeration capability: Virtual COM port, and debug port
- Comprehensive free software libraries and examples available with the STM32CubeN6 MCU Package
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
- Handled by STM32CubeMonitor-UCPD (STM32CubeMonUCPD) software tool.
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精选 视频
This demo showcases: An edge AI computer vision use case, leveraging the ST Neural-ART accelerator™ NPU, the MIPI CSI-2 camera interface, and the dedicated ISP designed for accelerating and optimizing the camera output and pipeline. Different high-performance graphical user interfaces utilizing the NeoChrom GPU and JPEG Codec to accelerate most graphics operations.
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所有资源
资源标题 | 版本 | 更新时间 |
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Board Manufacturing Specifications (5 of 8)
资源标题 | 版本 | 更新时间 | ||
---|---|---|---|---|
ZIP | 2.2 | 15 Oct 2024 | 15 Oct 2024 | |
ZIP | 2.2 | 15 Oct 2024 | 15 Oct 2024 | |
ZIP | 1.0 | 24 Jul 2024 | 24 Jul 2024 | |
ZIP | 1.0 | 28 Jun 2024 | 28 Jun 2024 | |
ZIP | 2.1 | 06 Dec 2024 | 06 Dec 2024 | |
ZIP | 2.0 | 15 Oct 2024 | 15 Oct 2024 | |
ZIP | 1.0 | 06 Dec 2024 | 06 Dec 2024 | |
ZIP | 1.0 | 15 Oct 2024 | 15 Oct 2024 |
物料清单 (4)
资源标题 | 版本 | 更新时间 | ||
---|---|---|---|---|
ZIP | 2.1 | 15 Oct 2024 | 15 Oct 2024 | |
ZIP | 1.0 | 28 Jun 2024 | 28 Jun 2024 | |
ZIP | 2.0 | 15 Oct 2024 | 15 Oct 2024 | |
ZIP | 1.0 | 15 Oct 2024 | 15 Oct 2024 |
Schematic Pack (4)
资源标题 | 版本 | 更新时间 | ||
---|---|---|---|---|
1.1 | 15 Oct 2024 | 15 Oct 2024 | ||
1.0 | 28 Jun 2024 | 28 Jun 2024 | ||
1.0 | 31 Jan 2024 | 31 Jan 2024 | ||
1.0 | 06 Dec 2024 | 06 Dec 2024 |
质量与可靠性
产品型号 | Marketing Status | 符合RoHS级别 | 材料声明** |
---|---|---|---|
STM32N6570-DK | 批量生产 | Ecopack1 | |
STM32N6570-DK
Package:
Ecopack1Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
样片和购买
产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 供应商 | Specific features | WEEE Compliant | 核心产品 | |
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STM32N6570-DK | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
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STM32N6570-DK 批量生产