产品概述
描述
TSV772是双20 MHz带宽单位增益稳定放大器。轨到轨输入级和13 V/µs的转换速率使TSV772成为低侧电流测量的理想选择。200 µV的最大输入电压提供高精度，允许精确放大小振幅输入信号。
TSV772可以在2.0 V - 5.5 V的单电源供电下运行；完全特征化的输出电容可达47 pF，也可轻松用作A/D转换器输入缓冲区。
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所有功能
- 增益带宽积20 MHz，单位增益稳定
- 低输入偏移电压：典型值为50 µV，最大值为200 µV。
- 低输入偏置电流：2 pA（典型值）。
- 低噪音：7 nV/√Hz
- 电压转换率：13 V/µs
- 宽电源电压范围：2.0 V至5.5 V
- 轨到轨输入和输出
- 4 kV HBM ESD容差
- 输入共模范围包括低轨
- 更宽的温度范围：-40°C 至 +125 °C
- 可提供汽车级版本
- 优势：
测量精度几乎不受噪声或输入偏置电流的影响 高频信号调节
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
Power Management Design Center
Thermal-electrical Simulators for Components
Signal Conditioning Design Tool
NFC/RFID Calculators
Choose design tool: 
Power Management Design Center
Power Supply Design Tool
• SMPS design, by topology, by type and by product
• PFC design with analog and digitial control
• Supports various PCB configurations
Choose type: DC/DC AC/DC 太阳能电池充电器
Power Management Design Center
LED Lighting Design Tool
• Handles AC-DC and DC-DC design in common topologies
• Displays interactive and annotated schematic
• Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data
Choose type: DC/DC AC/DC
Power Management Design Center
Digital Power Workbench
• Provides a step-by-step optimized design of power section and control loop
• Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs
Power Management Design Center
Power Tree Designer
• Specify input/output power for each node in the tree
• Check for consistency
• Design each individual node
Choose design tool: 
Thermal-electrical Simulators for Components
AC Switches Simulator
• Select ratings and application waveforms
• Get junction temperature and blocking voltage graphs
• Search and sort suitable devices
Thermal-electrical Simulators for Components
Rectifier Diodes Simulator
• Select ratings and application waveforms
• Estimate power losses
• Search and sort suitable devices
Thermal-electrical Simulators for Components
STPOWER Studio
• Supports long mission profiles
• Provides power loss and temperature graphs
• Helps define heatsink thermal properties
Thermal-electrical Simulators for Components
Twister Sim
• Help select the right ViPOWER Automotive power device
• Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis
• Supports various PCB configurations
Thermal-electrical Simulators for Components
TVS Simulator
• Specify system ratings and surge waveform
• Search and sort suitable devices
Thermal-electrical Simulators for Components
Estimate
• Build simple schematics and firmware inputs in minutes
• Quickly generate reliable estimates of battery life, system power consumption and bill of materials costs
Choose design tool: 
Signal Conditioning Design Tool
Active Filters
• Handles multi-stage-designs and common topologies
• Returns circuit component values
• Provides gain, phase and group delay graphs
• Low Pass, High Pass and Band Pass
Signal Conditioning Design Tool
Comparators
• Handles most common configurations
• Returns circuit components values
• Provides I/O signal waveforms
• Inverting, Non Inverting, Window
Signal Conditioning Design Tool
Low side Current Sensing
• Returns circuit component values
• Provides current error graphs
Signal Conditioning Design Tool
High side Current Sensing
• Provides current error graphs.
• Help to select the right High side current sensing and shunt devices.
Choose design tool: 
NFC/RFID Calculators
NFC Inductance
• Input geometry and substrate properties
• Get antenna impedance
NFC/RFID Calculators
UHF Link Budget
• Enter forward and reverse link characteristics
• The tool returns link budget estimate
NFC/RFID Calculators
NFC Tuning Circuit
• Enter antenna parameter and matching target
• Select the topology of the matching network
• The tool returns component values for the desired design targets
特别推荐
EDA符号、封装和3D模型
意法半导体 - TSV772
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV772IDT | 批量生产 | SO-8 | 工业 | Ecopack3 | |
| TSV772IQ2T | 批量生产 | QFN-8L P 0.5 mm | 工业 | Ecopack3 | |
| TSV772IST | 批量生产 | MiniSO-8 | 工业 | Ecopack3 | |
| TSV772IYDT | 批量生产 | SO-8 | 汽车应用 | Ecopack3 | |
| TSV772IYST | 批量生产 | MiniSO-8 | 汽车应用 | Ecopack3 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | 等级规格 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||
| TSV772IYST | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| TSV772IYDT | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| TSV772IDT | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| TSV772IQ2T | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| TSV772IST | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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TSV772IYST 批量生产
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TSV772IYDT 批量生产
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distributors
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包:
包装类型:
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ECCN (US):
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TSV772IDT 批量生产
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distributors
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包:
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ECCN (US):
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TSV772IQ2T 批量生产
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distributors
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包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):
TSV772IST 批量生产
Budgetary Price (US$)*/Qty:
-
distributors
无法联系到经销商，请联系我们的销售办事处
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):
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