产品概要
描述
STMicroelectronics BALF-NRF01D3 is an ultraminiature balun. The BALF-NRF01D3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/QFAB, and nRF51422-QFAA/QFAB RF transceivers.
The BALF-NRF01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
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性能一览
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated Flip-Chip on Glass
- Small footprint: < 1.5 mm2
- Benefits
- Very low profile: < 560 μm after reflow
- High RF performance
- PCB space saving versus discrete solution
- BOM count reduction
- Efficient manufacturability
EDA Symbols, Footprints and 3D Models
所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
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CAD Symbol & Footprint models (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 07 Jun 2021 | 07 Jun 2021 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| BALF-NRF01D3 | Active 产品已量产 | Chip Scale Package 0.4mm pitch | Industrial | Ecopack2 | - | - |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | Minimum Sellable Quantity | ||
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| 最小值 | 最大值 | ||||||||||||||
| BALF-NRF01D3 | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
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BALF-NRF01D3 Active