Product overview
描述
该器件是一款超小型匹配巴伦。
其匹配阻抗已针对ATMEL SmartConnect WILC1000无线链路控制器进行了优化。
该器件使用了意法半导体的IPD技术，并采用了可优化射频性能的非导电玻璃基板。
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All features
- 集成有匹配网络的2.45 GHz巴伦
- 已针对ATMEL WILC1000优化了匹配
- 低插入损耗
- 低幅度失衡
- 基于玻璃的涂层倒装片
- 低于 0.90 mm2 的小巧尺寸
- 优势
- 超薄型设计
- 高RF性能
- 比分立解决方案更加节省PCB空间
- 可有效减少物料数量
- 制造高效
EDA Symbols, Footprints and 3D Models
STMicroelectronics - BAL-WILC10-01D3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
|---|
CAD Symbol & Footprint models (2)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 02 Oct 2024 | 02 Oct 2024 | |||
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| BAL-WILC10-01D3 | Active 产品已量产 | Chip Scale Package 0.4mm pitch | Industrial | Ecopack2 | - | - |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | Minimum Sellable Quantity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAL-WILC10-01D3 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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BAL-WILC10-01D3 Active
Budgetary Price (US$)*/Qty:
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distributors
无法联系到经销商，请联系我们的销售办事处
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