ST4SIM-110M

批量生产

适用于安全M2M工业应用的SIM & eSIM片上系统解决方案

下载数据摘要

产品概述

描述

ST4SIM-110M是意法半导体专为各种工业设备设计的一款SIM和嵌入式SIM(eSIM或eUICC)产品。

ST4SIM-110M预先集成了可信赖合作伙伴提供的蜂窝连接配置。这样,产品便可随时部署到现场。

这款器件确保为所有eSIM利益相关者(用户、MNO、OEM、硬件集成商、服务提供商等)提供适当的安全级别。

它可包含一个嵌入式安全元件,用于存储由MCU(或另一个OEM元件)直接管理的凭证和/或独立应用程序。

该器件提供符合Java Card v3.0.4 Classic标准的安全、可互操作Java Card环境。此外,它还集成了符合GlobalPlatform、ETSI、3GPP、3GPP2规范的先进UICC功能。

这款器件将动态内存管理与优化内存使用的Java Card垃圾收集机制集成到一起。

它基于ST33G1M2M,这是一种可满足苛刻要求的工业级硬件解决方案 (JEDEC)。该解决方案采用了通过通用标准EAL5+认证的防篡改安全元件,具有强大的32位Arm SecurCore SC300 RISC内核。

  • 所有功能

      • 由可信赖合作伙伴提供的蜂窝网络连接配置
      • 符合2G/3G/4G (LTE)/CDMA/NB IoT/CAT-M网络规范
      • 支持的网络接入应用:SIM/USIM/ISIM/CSIM
      • 安全元件访问控制 (ARF/PKCS#15)
      • SMS、CAT-TP和HTTPS上的OTA功能(包括DNS)
      • 多接口可组合(U)SIM + eSE
    • 硬件
      • ST33G1M2M上可用的产品
      • 基于32位Arm® SecurCore® SC300 RISC内核的ST33产品
      • 电源电压:A类 (5 V)、B类 (3 V)、C类 (1.8 V)
      • 符合异步串行I/O端口ISO/IEC 7816-3规范(T=0协议)
      • 串行外设接口 (SPI),视具体封装而定
      • 工业认证 (JEDEC JESD47)
      • 工作温度:-40 °C至+105 °C
      • 通用标准EAL5+
    • 符合ECOPACK标准的封装
      • 2FF、3FF或4FF插件卡(基于D16微模块)
      • 采用可润湿侧翼的DFN8 (MFF2)
      • WLCSP11
    • 安全性
      • 对称加密DES/3DES/AES
      • 非对称加密RSA(最高2048位)
      • HTTPS远程管理TLS v1.0、v1.1和v1.2
      • 椭圆曲线加密(最多521位),包括预加载曲线NIST P-256和Brainpool P256r1
      • 身份验证算法:Comp128-2/-3、MILENAGE、TUAK、CAVE
    • 软件标准合规性
      • Java® Card v3.0.4 Classic
      • GlobalPlatform®卡规范v2.2,包括GP修正案A、B、C、D和E
      • ETSI、3GPP和3GPP2第12版(有关更多信息,请联系当地意法半导体销售办事处)
      • ETSI第13版定义的节能功能(PSM和eDRX)

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了解如何远程管理蜂窝网络连接

The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Marketing description of the package type.Compliancy of the device with industry requirement domains (IRD)The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.
Longevity Commitment in yearsLongevity Starting DateThe current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Budgetary PriceMarketing description of the package type.Storage method used to contain product.Main country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.The value as specified by level (minTypMax) of the ambient temperature (in Cel) in which this item was designed to operate.