产品概述
描述
The ST33KTPM-IDevID is a trusted platform module provisioned with keys and certificates to support use cases like device identity and attestation. The ST33KTPM-IDevID is compliant with TCG TPM 2.0 keys for device identity and attestation 1.1.
The IDevID key and X509 certificate provide the device identity defined by IEEE 802.1AR and are compatible with cloud system authentication such as AWS IoT, and Microsoft Azure, and can also be used in TLS 1.3 session to authenticate client.
The ST33KTPM-IDevID comes also with bundle files including device leaf certificates for a specific reel that are made available through authenticated download. This improves the supply chain security as the ST33KTPM-IDevID devices identified can be activated thanks to the bundle files after reception of reels, or can be revoked in case of lost shipment. This also facilitates the loading of leaf certificates in the cloud system before getting access to the physical platforms embedding ST33KTPM-IDevID devices.
The ST33KTPM-IDevID is based on product ST33KTPM2X compliant with the TCG TPM library specifications 1.59. It offers a target serial peripheral interface (SPI) or a target I²C interface, both compliant with the TCG PC client TPM profile specifications and PC client platform TPM profile (PTP) version 1.05.
ST33KTPM-IDevID devices are certified Common Criteria, TCG, and FIPS140-3.
It offers resilience services during the TPM firmware upgrade process, and self-recovery of TPM firmware and critical data upon failure detection.
The ST33KTPM-IDevID operates in the –40°C to 105°C extended temperature range.
The ST33KTPM-IDevID generic parts are loaded with X509 certificates signed by an STSAFE-TPM certification authority described in the provisioning profile. Upon customer request, STMicroelectronics can support a customer-specific provisioning profile and assign a dedicated certification authority linked to a specific ordering code.
ST33KTPM-IDevID devices with generic profile are based on ST33KTPM2X product offered in UFQFPN32 Ecopack2 package.
ST33KTPM-IDevID devices with customer profile are based either on ST33KTPM2X product offered in UFQFPN32 Ecopack2 package or on ST33KTPM2I product offered in WLCSP Ecopack2 package.
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所有功能
- TPM features
- Flash memory-based trusted platform module (TPM)
- Compliant with Trusted Computing Group (TCG) trusted platform module (TPM) Library specifications 2.0, revision 1.59 errata version 1.5 and TCG PC Client Platform TPM Profile (PTP) for TPM 2.0 version 1.05
- Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted
- SP800-193 compliant for protection, detection and recovery requirements
- Targeted certifications:
- Common Criteria EAL4+ in compliance with the TPM 2.0 protection profile (augmented with AVA_VAN.5, resistant to high-potential attacks)
- FIPS 140-3 with physical security level 3
- TCG certification
- 192 KB NV memory available to store keys and data
- SPI communication bus running at up to 66 MHz
- I²C communication bus running at up to 1 Mb/s
- IDevID and IAK provisioning
- ST33KTPM-IDevID devices are provisioned with 2 signing keys ECC NIST P-384 and 2 certificates to support device identity and attestation use cases, compliant with TCG TPM 2.0 Keys for Device identity and Attestation v1.1
- Hardware features
- Highly reliable flash memory with error correction code
- Extended temperature range: −40°C to 105°C
- Electrostatic discharge (ESD) protection up to 4 kV (HBM)
- 1.8 V or 3.3 V supply voltage range
- Security features
- Active shield
- Monitoring of environmental parameters
- Hardware and software protection against fault injection and side channel attacks
- NIST SP800-90A and AIS20-compliant deterministic random-bit generator (DRBG)
- NIST SP800-90B and AIS31-compliant true random-number generator (TRNG)
- Cryptographic algorithms:
- RSA key generation (1024, 2048, 3072 and 4096 bits)
- RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
- RSA encryption (RSAES-OAEP, RSAES-PKCS1-v1_5)
- SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
- HMAC SHA-1, SHA-2, and SHA-3
- AES-128, 192, and 256 bits
- ECC key generation (NIST P-256/384)
- ECC secret sharing (ECDH)
- ECC signature (ECDSA, ECSchnorr, ECDAA)
- Device provided with three endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P-256 and ECC NIST P-384)
- Device provisioned with three 2048-bit RSA key pairs to reduce the TPM provisioning time
- Product compliance
- Compliant with Microsoft® Windows® 10 and 11
- Compliant with Linux® drivers
- Compliant with Intel® vPro® technology
- Compliant with TCG test suite for TPM 2.0
- Compliant with the open-source TCG TPM 2.0 TSS implementation
- TPM features
EDA符号、封装和3D模型
意法半导体 - ST33KTPM-IDevID
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| ST33K2X32DKG9ST1 | 批量生产 | UFQFPN 32 5x5x0.55 mm | N/A | |
ST33K2X32DKG9ST1
Package:
UFQFPN 32 5x5x0.55 mmMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| ST33K2X32DKG9ST1 | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
ST33K2X32DKG9ST1 批量生产