产品概要
描述
EMIF06-HMC02F2是一款高度集成的阵列，专为抑制高速MultiMediaCard™端口滤波的EMI/RFI噪声而设计。EMIF06-HMC02F2采用Flip-Chip封装，封装尺寸与芯片尺寸相同。
此外，该滤波器集成了ESD保护电路，可防止受保护器件在承受高达15 kV的ESD浪涌时损坏。与EMIF06-HMC01F2相比，EMIF06-HMC02F2的接地焊球在内部相互连接。
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性能一览
- 6路低通滤波器
- 高效的EMI滤波性能
- 占用极少的PCB空间：< 4 mm²
- 无铅封装
- 超薄封装：0.65 mm
- 高效的ESD抑制性能
- 单片集成提供高可靠性
- 通过集成和晶圆级封装，显著减少寄生元件
EDA Symbols, Footprints and 3D Models
STMicroelectronics - EMIF06-HMC02F2
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所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
|---|
CAD Symbol & Footprint models (2)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 11 Jun 2021 | 11 Jun 2021 | |||
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| EMIF06-HMC02F2 | Active 产品已量产 | CSP P 0.5 mm | Industrial | Ecopack2 | - | - |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EMIF06-HMC02F2 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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