STG75M120F3D7
Obsolete
Design Win
1200 V, 75 A trench gate field-stop M series low-loss IGBT die in D7 packing

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Product overview

描述

该器件是一款采用先进专有沟槽栅极场截止结构设计的IGBT。该器件是M系列IGBT的一部分,代表了逆变器系统性能与效率之间的理想平衡,其中低损耗和短路功能至关重要。此外,VCE(sat)正温度系数特性及紧密的参数分布,进一步提升了并联操作的安全性。

  • All features

    • 短路耐受时间为10 μs
    • 低VCE(sat) = 1.85 V(典型值)@ IC = 75 A
    • 正VCE(sat) 温度系数
    • 参数分布紧密
    • 最高结温:TJ = 175 °C

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STMicroelectronics - STG75M120F3D7

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