SH68N65DM6AG

批量生产
Design Win

Automotive-grade N-channel 650 V, 35 mOhm typ., 64 A MDmesh DM6 half-bridge topology Power MOSFET in an ACEPACK SMIT package

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产品概述

描述

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.

  • 所有功能

    • AQG 324 qualified
    • Half-bridge power module
    • 650 V blocking voltage
    • Fast recovery body diode
    • Very low switching energies
    • Low package inductance
    • Dice on direct bond copper (DBC) substrate
    • Low thermal resistance
    • Isolation rating of 3.4 kVrms/min

EDA符号、封装和3D模型

STMicroelectronics - SH68N65DM6AG

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质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 材料声明**
SH68N65DM6AG
批量生产
ACEPACK SMIT 汽车应用 Ecopack2

SH68N65DM6AG

Package:

ACEPACK SMIT

Material Declaration**:

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Marketing Status

批量生产

Package

ACEPACK SMIT

Grade

Automotive

RoHS Compliance Grade

Ecopack2

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样片和购买

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SH68N65DM6AG
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SH68N65DM6AG 批量生产

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SH68N65DM6AG

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