产品概述
描述
This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.
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所有功能
- AQG 324 qualified
- Half-bridge power module
- 650 V blocking voltage
- Fast recovery body diode
- Very low switching energies
- Low package inductance
- Dice on direct bond copper (DBC) substrate
- Low thermal resistance
- Isolation rating of 3.4 kVrms/min
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EDA符号、封装和3D模型
STMicroelectronics - SH32N65DM6AG
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符号
封装
3D模型
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SH32N65DM6AG | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
SH32N65DM6AG 批量生产