产品概述
描述
The Teseo-LIV3F module is an easy to use Global Navigation Satellite System (GNSS) standalone module, embedding TeseoIII single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS).
The Teseo-LIV3F modules bring the proven accuracy and robustness of Teseo chips to the reach of everyone: the embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for several applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.
Within its 9.7x10.1 mm tiny size, Teseo-LIV3F is offerinDS12152g superior accuracy thanks to the on board 26 MHz Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying to its dedicated 32 KHz Real Time Clock (RTC) oscillator.
Thanks to the embedded 16 Mbit flash Teseo-LIV3F offers many extra features such as data logging, 7 days autonomous assisted GNSS, FW reconfigurability as well as FW upgrades.
Teseo-LIV3F provides also the Autonomous Assisted GNSS able to predict satellite data based on previous observation of satellite.
Teseo-LIV3F module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40°C to 85°C.
-
所有功能
- Simultaneously multiconstellation
- -163 dBm navigation sensitivity
- 1.5 m CEP accuracy positioning
- 16 Mbit embedded Flash for data logging and FW upgrade
- 2.1 V to 4.3 V supply voltage range
- Tiny LCC 18 pin package (9.7x10.1)
- Operating temperature (-40°, 85°C)
- Free FW configuration
- 17 μW standby current and 75 mW tracking power consumption
您可能还会喜欢...
特别推荐
EDA符号、封装和3D模型
意法半导体 - Teseo-LIV3F
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| TESEO-LIV3F | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
TESEO-LIV3F 批量生产