The camera module is based on the VD55G0 global shutter image sensor and is designed to work with 158° and 79° lenses, making it a versatile choice for various imaging applications. It has a 0.4MP pixel and features a 2.61um MOOM global shutter.
The camera module is based on a 3D stacked sensor with 40 nm/65 nm technology. It has a 2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench), which ensures high-performance imaging. It is the smallest sensor on the market with a die size of 2.6 mm x 2.5 mm and a resolution of 640-pixel x 600 pixel. Its pixel array is very small, measuring only 1.67 mm x 1.57 mm, and its optical format is between 1/9 inch. It has an operating junction temperature range of -30°C to 85°C, making it suitable for various environments.
The camera module features a single lane transmitter MIPI CSI-2 version 1.3, with a speed of 1.2 Gbps per lane. It also has a fast mode+ I²C control interface, an integrated temperature sensor, and can operate at up to 210 fps at full resolution and 260 fps with VGA resolution. It also has programmable sequences of 4-frame contexts, including frame parameters, automatic dark calibration, dynamic defective correction, and embedded autoexposure.
Overall, the camera module is an excellent choice for those looking for a high-performance imaging sensor with advanced features and a small form factor. Its compatibility with different lenses makes it a versatile choice for various imaging applications.
| 支持的器件 | VD55G0 |
| Device Type | 集成模组 |
| 功能 | Camera module |
| 地点 |