MIP single and dual-core modules 32001505x and 32001506x offer an ultralow-power, ultra-compact wireless solution for IoT applications using advanced LPWAN protocols. Featuring a compact 11.30 mm x 8.90 mm LGA package, these modules integrate multiple protocols such as LoRaWAN®, wM-Bus, Sigfox®, and MIOTY® with high radio performance for global deployment. Available in single-core and dual-core STM32WL series chipsets, they provide flexibility in firmware customization and support worldwide frequency bands, enabling versatile, secure, and scalable IoT connectivity.
Features and benefits
- Ultra-compact size: 11.30 mm x 8.90 mm LGA package for space-constrained designs
- Multi-protocol support: wM-Bus, LoRaWAN®, LoRa®, Sigfox®, and MIOTY® in one module
- Global frequency coverage: Supports sub-GHz bands including 868 MHz (Europe) and 915 MHz (USA/Canada)
- High radio performance: +14 dBm for Europe, +20 dBm for USA for robust wireless links
- Single and dual-core options: STM32WLE5 single-core and STM32WL55 dual-core for flexible firmware deployment
- Firmware customization: Dual-core modules allow user firmware installation in dedicated memory space
- Secure element option: Hardware security and firmware customization available on demand
- Latest IoT stacks: Includes LoRaWAN 1.0.4 and wM-BUS OMS 4 for up-to-date protocol compliance
| 支持的器件 | STM32 |
| 可交付成果 | 源文件 |
| 许可类型 | 商业（免费试用版） |
| 地点 |
| ST产品 |
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Served Countries:
全球