The EvB LoRa board is a compact evaluation and prototyping platform built around the iMCP-HTLRBL32L-10 system-in-package (SiP) from HT Micron. This SiP integrates an ST BlueNRG system-on-chip (SoC) microcontroller with Bluetooth® Low Energy and a LoRaWAN® interface with multi-region support, enabling dual wireless connectivity on a single module.
The board routes the SiP input/output pins to accessible headers, which simplifies hardware integration, firmware development, and radio frequency (RF) evaluation. The board is designed as a starting point for developing LoRaWAN and Bluetooth® Low Energy Internet of Things (IoT) sensor nodes, gateways, and edge devices. Developers can use the board to test communication, power profiles, and application logic before designing a custom printed circuit board (PCB).
Features and benefits
- Integrated dual-radio SiP: iMCP-HTLRBL32L-10 combines Bluetooth® Low Energy (ST BlueNRG) and multi-region LoRaWAN® connectivity
- Dual wireless connectivity: Long-range, low-power LoRaWAN® and short-range Bluetooth® Low Energy for commissioning, diagnostics, or local control
- Accessible input/output: SiP input/output pins routed to headers for easy access to general-purpose input/output (GPIO), serial interfaces, and control signals
- Development-optimized design: Suitable for firmware and protocol development and rapid prototyping with standard ST BlueNRG tools
- Compact, RF-optimized PCB: Small footprint for laboratory evaluation and early field trials
- Reduced design effort and risk: Integrated RF and validated radio platform reduce RF complexity and hardware risk
- Accelerated productization: Reference platform to speed transition to custom, production PCBs using the same SiP
