STM32MP157F

批量生产
Design Win Education

MPU with Arm Dual Cortex-A7 800 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography

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产品概述

主要优势

Mainlined OpenSTLinux Distribution

One OpenSTLinux Software compatible with STM32MP1 Series. OpenSTLinux expansion packages can be applied on the top to enable the use of additional components.

3D GPU

Specifically designed to accelerate 3D graphics in applications such as graphical user interfaces (GUI)

MIPI DSI protocol

Supporting advanced features to deliver displays with higher resolution and quality.

描述

The STM32MP157C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.

The STM32MP157C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.

The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.

All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • 所有功能

    • 内核
      • 32-bit dual-core Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D for each core
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • 存储器
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • DDR memory retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 6 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 tampers, 1 active tamper
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 3 DMA controllers to unload the CPU
      • 48 physical channels in total
      • 1 × high-speed general-purpose master direct memory access controller (MDMA)
      • 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 37 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™/ SDIO)
      • 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • 3D GPU: Vivante® - OpenGL® ES 2.0
        • Up to 26 Mtriangle/s, 133 Mpixel/s
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 × 1080) @30 fps
        • Pixel clock up to 90 MHz
        • Two layers with programmable colour LUT
      • MIPI® DSI 2 data lanes up to 1 GHz each
    • Up to 29 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • AES 128, 192, 256, TDES
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
    • All packages are ECOPACK2 compliant

电路原理图

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EDA符号、封装和3D模型

STMicroelectronics - STM32MP157F

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 材料声明**
STM32MP157FAA1
批量生产
LFBGA 448 18x18x1.7 P 0.8 mm 工业 Ecopack2
STM32MP157FAA1T
批量生产
LFBGA 448 18x18x1.7 P 0.8 mm 工业 Ecopack2
STM32MP157FAB1
批量生产
LFBGA 354 16x16x1.7 P 0.8 mm 工业 Ecopack2
STM32MP157FAC1
批量生产
TFBGA 361 12x12x1.2 P 0.5 mm 工业 Ecopack2
STM32MP157FAD1
批量生产
TFBGA 257 10x10x1.2 P 0.5 mm 工业 Ecopack2

STM32MP157FAA1

Package:

LFBGA 448 18x18x1.7 P 0.8 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

LFBGA 448 18x18x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157FAA1T

Package:

LFBGA 448 18x18x1.7 P 0.8 mm

Material Declaration**:

Marketing Status

批量生产

Package

LFBGA 448 18x18x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157FAB1

Package:

LFBGA 354 16x16x1.7 P 0.8 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

LFBGA 354 16x16x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157FAC1

Package:

TFBGA 361 12x12x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

TFBGA 361 12x12x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157FAD1

Package:

TFBGA 257 10x10x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

TFBGA 257 10x10x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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ECCN (EU)
Junction Temperature (°C) (min)
Junction Temperature (°C) (max)
STM32MP157FAA1
Available at distributors

经销商的可用性 STM32MP157FAA1

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STM32MP157FAD1
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经销商的可用性 STM32MP157FAD1

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STM32MP157FAA1T
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经销商的可用性 STM32MP157FAA1T

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STM32MP157FAB1
Available at distributors

经销商的可用性 STM32MP157FAB1

代理商名称
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代理商库存报告日期:

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STM32MP157FAC1
Available at distributors

经销商的可用性 STM32MP157FAC1

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

STM32MP157FAA1 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STM32MP157FAA1

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

代理商名称

代理商库存报告日期:

STM32MP157FAD1 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STM32MP157FAD1

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

代理商名称

代理商库存报告日期:

STM32MP157FAA1T 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STM32MP157FAA1T

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

STM32MP157FAB1 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STM32MP157FAB1

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

代理商名称

代理商库存报告日期:

STM32MP157FAC1 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STM32MP157FAC1

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

代理商名称

代理商库存报告日期:

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商