产品概要
描述
STMicroelectronics has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses STMicroelectronics unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration.
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性能一览
- Integrated temperature compensation and calibration
- Ratiometric to supply voltage
- Polysulfone case material (ISO 10993)
- Provided in easy-to-use tape and reel
EDA Symbols, Footprints and 3D Models
STMicroelectronics - MPXC2011D
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|
| MPXC2011DT1 | Active 产品已量产 | SIL4_6.35x9.25_1.27p 4L | Ecopack1 | - | - | |
MPXC2011DT1
Package:
SIL4_6.35x9.25_1.27p 4LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MPXC2011DT1 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
MPXC2011DT1 Active