产品概述
主要优势
Accurately measuring high and low accelerations
Capture and process all relevant data even in extreme situations unlocking new possibilities.
Processing at the edge
Best system optimization with processing at the edge and self-configuration.
PCB spacing and BOM cost reduction
A single IMU that embeds two accelerometer structures (16g + 80g) and a gyroscope.
描述
The LSM6DSV80X is a breakthrough in the world of wearable technology. Its ability to handle both high and low acceleration values, combined with its energy efficiency and advanced processing capabilities, makes it a sensor for anyone looking to acquire data for in-depth analysis and achieve better performance in high-intensity impact and tracking activities in sports such as volleyball, soccer, tennis, boxing, or explosive jumps, and so forth. This IMU is a comprehensive solution for wearables, high-intensity impact and activity tracking, offering a blend of accuracy, integration, and efficiency.
The LSM6DSV80X is the world's first IMU to combine high-g (80 g) and low-g capabilities in a single package, integrating advanced features (edge processing and sensor fusion) and delivering consistent performance and valuable data for tracking and high-intensity impact detection in sports wearables.
The device enables edge AI, leveraging on a finite state machine (FSM) for configurable motion tracking and a machine learning core (MLC) for context awareness with exportable AI features for wearable applications.
The LSM6DSV80X supports the adaptive self-configuration (ASC) feature, which allows automatically reconfiguring the device in real time based on the detection of a specific motion pattern or based on the output of a specific decision tree configured in the MLC, without any intervention from the host processor.
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所有功能
- Dedicated and independent gyroscope, low-g and high-g accelerometer channels, and data processing
- Smart FIFO up to 4.5 KB
- Dual accelerometer channels
- Low-g channel ±2/±4/±8/±16 g full scale
- High-g channel ±32/±64/±80 g full scale
- ±250/±500/±1000/±2000/±4000 dps full scale
- SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
- Programmable finite state machine for high-g and low-g accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
- Machine learning core with exportable features and filters for AI applications
- Embedded adaptive self-configuration (ASC)
- Embedded sensor fusion low-power (SFLP) algorithm
- Embedded temperature sensor
- Independent I/O supply
- I²C voltage range: 1.62 V to 3.6 V
- SPI / MIPI I3C® extended voltage range: 1.08 V to 3.6 V
- Supply current
- 6-axis configuration @ 0.67 mA in combo high-performance mode
- 9-axis configuration @ 0.80 mA in combo high-performance mode
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- ECOPACK and RoHS compliant
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特别推荐
EDA符号、封装和3D模型
意法半导体 - LSM6DSV80X
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符号
封装
3D模型
质量与可靠性
| 料号 | Marketing Status | 包 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|
| LSM6DSV80XTR | 批量生产 产品已量产 | LGA 14L 2.5x3x0.86 mm | Ecopack2 | - | - |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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样片和购买
| 料号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| LSM6DSV80XTR | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
LSM6DSV80XTR 批量生产