产品概述
描述
FXLS8964AF is a compact 3-axis MEMS accelerometer designed for use in automotive remote keyless entry (key fob) applications that require ultra-low-power wake-up on motion. The part supports both high-performance and low-power operating modes, allowing maximum flexibility to meet the resolution and power needs for various use case implementations. A number of advanced, integrated digital features enable designers to reduce the overall system power consumption and simplify host data collection.
FXLS8964AF is available in a 2 mm x 2 mm x 0.95 mm 10-pin DFN package with 0.4 mm pitch and wettable flanks. The device is qualified to AEC-Q100 and operates over the extended –40°C to +105°C temperature range. The combination of sensor performance, system power-saving features, and extended over-temperature-range performance makes FXLS8964AF an ideal accelerometer for automotive security and convenience applications.
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所有功能
- ±2/4/8/16 g user-selectable, full-scale measurement ranges
- 12-bit acceleration data
- 8-bit temperature sensor data
- Low noise: 280 µg/√Hz typical in high-performance mode
- Low-power capability:
- ≤ 1 μA IDD for ODRs up to 6.25 Hz
- < 4 µA IDD for ODRs up to 50 Hz
- Selectable ODRs up to 3200 Hz; Flexible Performance mode allows for custom ODRs with programmable decimation (resolution) and idle-time settings
- 144 byte output data buffer (FIFO/LIFO) capable of storing up to 32 12-bit X/Y/Z data triplets
- Flexible Sensor Data Change Detection (SDCD) function for realizing motion or no motion, high-g/low-g, freefall, and other inertial events
- Autonomous orientation detection function (portrait/landscape/up/down)
- Dedicated low-power motion-detection mode with one wire interface option
- 12-bit vector magnitude calculation
- Trigger input for synchronizing data collection with an external system
- I²C interface frequencies up to 1 MHz; 3- and 4-wire SPI interface with clock frequencies up to 4 MHz
- Bidirectional, robust self-test diagnostic: Device motion or orientation does not impact the result.
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EDA符号、封装和3D模型
意法半导体 - FXLS8964AF
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符号
封装
3D模型
质量与可靠性
| 料号 | Marketing Status | 包 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|
| FXLS8964AFR3 | 批量生产 | VSON10 2 x 2 x 0.95 mm | Ecopack1 | 15 | 2022-07-31T00:00:00.000+02:00 | |
FXLS8964AFR3
Package:
VSON10 2 x 2 x 0.95 mmMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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样片和购买
| 料号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| FXLS8964AFR3 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
FXLS8964AFR3 批量生产