产品概述
描述
The ASM330LHHG1 is a 6-axis IMU featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with an extended temperature range up to +125°C, designed to address automotive nonsafety applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer markets. The ASM330LHHG1 is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level.
The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better match the characteristics of the sensing element.
The ASM330LHHG1 has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of automotive applications.
The device supports dual operating modes: high-performance mode and low-power mode.
All the design aspects of the ASM330LHHG1 have been optimized to reach superior output stability, extremely low noise, and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and sensor fusion.
The ASM330LHHG1 is available in an overmolded 14-lead plastic, land grid array (LGA) package.
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所有功能
- AEC-Q100 qualified
- Android Auto™ compliant and CarPlay® compliant
- Extended temperature range from -40 to +125°C
- Embedded compensation for high stability over temperature
- Accelerometer user-selectable full scale up to ±16 g
- Extended gyroscope range from ±125 to ±4000 dps
- Dual operating modes: high-performance and low-power mode
- I²C, MIPI I3C®, and SPI serial interfaces
- Six-channel synchronized output to enhance the accuracy of dead-reckoning algorithms
- Smart programmable interrupts
- Embedded 3 KB FIFO available to underload host processor
- ECOPACK and RoHS compliant
EDA符号、封装和3D模型
意法半导体 - ASM330LHHG1
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符号
封装
3D模型
质量与可靠性
| 料号 | Marketing Status | 包 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|
| ASM330LHHG1TR | 批量生产 | LGA 14L 2.5x3x0.86 mm | Ecopack2 | 15 | 2023-07-01T00:00:00.000+02:00 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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样片和购买
| 料号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| ASM330LHHG1TR | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
ASM330LHHG1TR 批量生产