ASM330LHBG1

批量生产
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用于汽车电子控制单元的高精度汽车6轴惯性

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产品概述

描述

The ASM330LHBG1 is a 6-axis IMU that offers ASIL B compliance if used in conjunction with a certified software library and features a 3-axis digital accelerometer and a 3-axis digital gyroscope with an extended temperature range up to +125°C.

A safety manual and a software library, certified according to ISO 26262:2018, are provided to support the development of applications using the ASM330LHBG1 and targeting ASIL B requirements.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer market. The ASM330LHBG1 is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level.

The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better match the characteristics of the sensing element.

The ASM330LHBG1 has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of automotive applications.

The device supports dual operating modes: high-performance mode and low-power mode.

All the design aspects of the ASM330LHBG1 have been optimized to reach superior output stability, extremely low noise, and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and sensor fusion.

The ASM330LHBG1 is available in a 14-lead plastic, land grid array (LGA) package.

  • 所有功能

    • AEC-Q100 qualified
    • ASIL B compliant if used in conjunction with a certified software library (ISO 26262:2018)
    • Android Auto™ compliant and CarPlay® compliant
    • Extended temperature range from -40 to +125°C
    • Embedded compensation for high stability over temperature
    • Accelerometer user-selectable full scale up to ±16 g
    • Extended gyroscope range from ±125 to ±4000 dps
    • Dual operating modes: high-performance and low-power mode
    • I²C, MIPI I3C℠, and SPI serial interfaces
    • Six-channel synchronized output to enhance accuracy of dead-reckoning algorithms
    • Programmable finite state machine
    • Machine learning core
    • Smart programmable interrupts
    • Embedded 3 KB FIFO available to underload host processor
    • ECOPACK and RoHS compliant

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EDA符号、封装和3D模型

意法半导体 - ASM330LHBG1

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质量与可靠性

产品型号 Marketing Status 符合RoHS级别 材料声明**
ASM330LHBG1TR
批量生产
LGA 14L 2.5x3x0.86 mm Ecopack2

ASM330LHBG1TR

Package:

LGA 14L 2.5x3x0.86 mm

Material Declaration**:

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Marketing Status

批量生产

Package

LGA 14L 2.5x3x0.86 mm

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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ASM330LHBG1TR
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ASM330LHBG1TR 批量生产

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商