产品概述
描述
The M95512 devices are electrically erasable programmable memories (EEPROMs) organized as 65536 x 8 bits, accessed through the SPI bus.
The M95512-W can operate with a supply voltage from 2.5 V to 5.5 V, the M95512-R can operate with a supply voltage from 1.8 V to 5.5 V and the M95512-DF can operate with a supply voltage from 1.7 V to 5.5 V, over an ambient temperature range of -40 °C / +85 °C.
The M95512-DF offers an additional page, named the Identification page (128 bytes). The Identification page can be used to store sensitive application parameters that can be (later) permanently locked in read-only mode.
The SPI bus signals are C, D and Q, as shown in Figure 1 and Table 1. The device is selected when Chip select (S) is driven low. Communications with the device can be interrupted when the HOLD is driven low.
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所有功能
- Compatible with the serial peripheral interface (SPI) bus
- Memory array
- 512-Kbit (64-Kbyte) of EEPROM
- Page size: 128 bytes
- Additional write lockable page (Identification page)
- Write time
- Byte Write within 5 ms
- Page Write within 5 ms
- Write protect
- quarter array
- half array
- whole memory array
- High-speed clock: 16 MHz
- Single supply voltage:
- 2.5 V to 5.5 V for M95512-W
- 1.8 V to 5.5 V for M95512-R
- 1.7 V to 5.5 V for M95512-DF
- Operating temperature range: from -40 °C up to +85 °C
- Enhanced ESD protection
- More than 4 million Write cycles
- More than 200-year data retention
- Packages
- SO8N (ECOPACK2)
- TSSOP8 (ECOPACK2)
- UFDFPN8 (ECOPACK2)
- WLCSP8 (ECOPACK2)
EDA符号、封装和3D模型
STMicroelectronics - M95512-DF
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
所有资源
| 资源标题 | 版本 | 更新时间 |
|---|
IBIS models (5 of 11)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 27 Jun 2024 | 27 Jun 2024 | |
| ZIP | 1.0 | 13 Jan 2023 | 13 Jan 2023 | |
| ZIP | 1.0 | 04 Oct 2021 | 04 Oct 2021 | |
| ZIP | 1.0 | 17 Mar 2023 | 17 Mar 2023 | |
| ZIP | 1.0 | 06 Jun 2023 | 06 Jun 2023 | |
| ZIP | 1.0 | 25 Jan 2021 | 25 Jan 2021 | |
| ZIP | 1.0 | 25 Jan 2021 | 25 Jan 2021 | |
| ZIP | 1.0 | 25 Jan 2021 | 25 Jan 2021 | |
| 7Z | 1.1 | 07 Jun 2023 | 07 Jun 2023 | |
| ZIP | 1.0 | 25 Jan 2021 | 25 Jan 2021 | |
| ZIP | 1.0 | 25 Jan 2021 | 25 Jan 2021 |
CAD Symbol & Footprint models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 27 Apr 2021 | 27 Apr 2021 |
Verilog models (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 22 Jan 2021 | 22 Jan 2021 | |
| ZIP | 1.0 | 28 Jan 2021 | 28 Jan 2021 |
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| M95512-DFCS6TP/K | 批量生产 | WLCSP | 工业 | Ecopack2 | |
| M95512-DFDW6TP | 批量生产 | TSSOP-8L | 工业 | Ecopack2 | |
| M95512-DFMC6TG | 批量生产 | UFDFPN8 | 工业 | Ecopack2 | |
| M95512-DFMN6TP | 批量生产 | SO8 | 工业 | Ecopack2 | |
| M95512DFKW20I/90 | 批量生产 | WAFER | 工业 | N/A |
M95512-DFDW6TP
Package:
TSSOP-8LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | 免费样片 | ESample Max Qty | 替代产品 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||||
| M95512-DFDW6TP | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| M95512-DFMN6TP | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| M95512-DFCS6TP/K | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| M95512-DFMC6TG | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| M95512DFKW20I/90 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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M95512-DFDW6TP 批量生产
M95512-DFMN6TP 批量生产
M95512-DFCS6TP/K 批量生产
M95512-DFMC6TG 批量生产
M95512DFKW20I/90 批量生产