STM32MP257F-DK

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配备STM32MP257F MPU的探索套件

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产品概述

描述

STM32MP257F-DK探索套件是为意法半导体STM32MP257FAK3(基于Arm® Cortex® A35和M33内核)设计的完整演示和开发平台。

该产品充分利用STM32MP2系列微处理器的能力,让用户可以使用面向主处理器(Arm®双核Cortex®-A35)的STM32 MPU OpenSTLinux发行版软件和面向协处理器 (Arm® Cortex®‑M33) 的STM32CubeMP2软件来开发应用。

产品包含嵌入式调试工具ST-LINK、LED指示灯、按键、1 Gbit/s以太网接口、1个USB3 USB Type-C®PD接口、2个堆叠式USB2.0 HS Type-A接口、1个LCD LVDS显示连接器、1个HDMI连接器、1个摄像头连接器、microSD™卡、Wi-Fi®802.11b/g/n、Bluetooth®低功耗4.1以及eMMC。为扩展STM32MP257F-DK功能,还提供用于Raspberry Pi®屏蔽板的GPIO扩展连接器。

  • 所有功能

    • STM32MP257FAK3微处理器基于Arm®双核Cortex®-A35(运行频率1.5 GHz)和Cortex®-M33(运行频率400 MHz),采用VFBGA424封装。
    • 意法半导体电源管理STPMIC25
    • 32‑Gbit LPDDR4 DRAM
    • 64-Gbit eMMC v5.1
    • 1-Gbit/s以太网 (RGMII)
    • 2个USB 2.0高速接口
    • USB 3.0超高速PD (DRP/DRD)
    • Wi‑Fi® 802.11b/g/n
    • Bluetooth®低功耗v4.1
    • 四个用户LED
    • 两个用户按钮、一个防篡改按钮以及一个复位按钮
    • 唤醒按钮
    • 四个启动引脚开关
    • 开发板连接器:
      • 以太网RJ45
      • 两个堆叠式USB 2.0 HS Type-A
      • USB 3.0 USB Type-C® PD
      • microSD™卡槽
      • 双通道MIPI CSI-2®摄像头模块扩展连接器
      • HDMI®
      • LVDS
      • GPIO扩展连接器
      • 用于备用电源的VBAT
    • 板载STLINK-V3EC:
      • 具有USB重新枚举功能的调试器:虚拟COM端口和调试端口
      • 通过USB Type-C®为开发板供电(建议连接5 V/3 A USB主机端口)
    • 主流开源Linux® STM32 MPU OpenSTLinux发行版和STM32CubeMP2软件及其示例
    • Linux® Yocto Project®、Buildroot和STM32CubeIDE作为开发环境

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The current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
The RoHS status of a product:
ECOPACK 1: Initial grade to identify European RoHS compliant products.
ECOPACK 2: New grade to identify brominated chlorinated and antimony oxide flame retardant free products.
ECOPACK 3: Halogen free RoHS exemptions free products.
(*): ECOPACK 2 version available upon request.
(**): Some versions still existing in ECOPACK 1 or not compliant.
Longevity Commitment in yearsLongevity Starting DateThe current status of a product:
Active: Product is in volume production
Evaluation: Product is under characterization. Limited Engineering samples available
Preview: Product is in design stage
Target: Product is in design feasibility stage.No commitment taken to produce
Proposal: Marketing proposal for customer feedback.No commitment taken to design or produce
NRND: Not Recommended for New Design.Product is in volume production only to support customers ongoing production.
Budgetary PriceMain country of assembly or fabrication of the product.ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes. ECCNs are five character alpha-numeric designations used on the Commerce Control List to identify dual-use items for export control purposes.