产品概要
描述
The main objective of the STM32WL3xxx microcontroller reference designs is to recommend a layout and associated BOM for dedicated applications (these boards are not for sale).
These reference designs can be manufactured from files available for download from the www.st.com website. The access to all GPIOs allows the prototyping of a complete application.
Sensitive layout parts can be extracted and pasted in any user board design with the same PCB characteristics and feature set.
The STM32WL3xxx microcontroller reference designs are provided with the STM32WL3xxx comprehensive software HAL library. The STM32CubeWL3 MCU Package contains many software examples developed with the STM32WL3xxx Nucleo-64 boards (NUCLEO-WL33CC1 and NUCLEO-WL33CC2). These examples can be easily adapted for the STM32WL3xxx microcontroller reference designs.
Using the reference designs to design the user application helps to get the right RF performance and to pass certification.
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性能一览
- Includes ST state-of-the-art patented technology
- Reference designs
- Fully open hardware platforms
- Suitable for rapid prototyping of end nodes based on Sigfox™, Wireless M-Bus, mioty, and many other proprietary protocols
- STM32WL3xxx microcontroller
- Ultra-low power sub-GHz wireless system-on-chip
- Programmable MCU
- Core: Arm® Cortex®‑M0+ 32‑bit, running up to 64 MHz
- Program memory: 64‑Kbyte, 128‑Kbyte, or 256‑Kbyte flash memory
- RF transceiver (frequency bands: 159‑185 MHz, 276‑319 MHz, 413‑479 MHz, 826‑958 MHz) supporting 2(G)FSK, 2(G)MSK, 4(G)FSK, OOK, ASK, D-BPSK, DSSS modulations
- Low-power autonomous wake-up receiver (LPAWUR)
- Oscillators
- 48 MHz or 50 MHz HSE (on-board TCXO or XO)
- 32.768 kHz LSE crystal
- Connectors
- 2×25 header
- SMA
- Supply voltage
- 1.7 V to 3.6 V
所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
|---|
Board Manufacturing Specifications (2)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 08 Sep 2026 | 08 Sep 2026 | |||
| ZIP | 1.0 | 08 Sep 2026 | 08 Sep 2026 |
BOM (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 08 Sep 2026 | 08 Sep 2026 |
Schematic Pack (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 1.0 | 08 Sep 2026 | 08 Sep 2026 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | WEEE Compliant | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|---|
| STDES-WL3K2SMR | Active 产品已量产 | - | Industrial | - | - | - | - | |
STDES-WL3K2SMR
Package:
-Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Core Product | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STDES-WL3K2SMR | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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STDES-WL3K2SMR Active