MTP-TC3P-DVK

描述

The MTP (modular telematics platform) provides an open development environment for prototyping smart driving applications, including vehicle connectivity to cloud services, to infrastructure and to other vehicles.

At the core of the MTP there is the ST Telmo and a set of module that integrates the ST’s Telemaco3P (STA1385) ASIL-B processor for an extended set of the NVM and DDR memories. The STA1385 device is automotive qualified for extended thermal range up to +150 °C junction temperature and includes a dedicated and isolated hardware security module to provide state-of-the-art on-chip security against automotive cyber-attacks.

The MTP also integrates ST’s automotive-grade multi-constellation GNSS Teseo IC with dead-reckoning sensors and offers expansion connector for optional plug-in TeseoAPP precise positioning module.

The platform enables the direct connection of automotive buses such as CAN, FlexRay, and BroadR-Reach® (100Base-T1), and features expansion connectors for several wireless connectivity options including BLE, Wi-Fi, LTE modules as well as V2X modules based on Autotalks Craton2 / Pluton2 products.

The MTP is delivered with a comprehensive starter package including everything required for the users to get started quickly, e.g. hardware design files, Linux BSP SW based on Yocto, sample application SW, optimized GNSS firmware and software tools (Teseo Suite, Flash Loader, UART port drivers).