TSV621A - 微功耗（29uA）低偏移轨到轨输入/输出5V CMOS单路运算放大器，GBP = 420kHz - 意法半导体STMicroelectronics

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产品概述

描述

The TSV621 is a single operational amplifier offering low voltage, low power operation and railto- rail input and output.

With a very low input bias current and low offset voltage (800 µV maximum for the A version), the TSV621 is ideal for applications that require precision. The device can operate at a power supply ranging from 1.5 to 5.5 V, and therefore suits battery-powered devices and extends battery life.

This product features an excellent speed/power consumption ratio, offering a 420 kHz gain bandwidth while consuming only 29 µA at a 5-V supply voltage.

This operational amplifier is unity gain stable for capacitive loads up to 100 pF.

The device is internally adjusted to provide very narrow dispersion of AC and DC parameters, especially power consumption, product gain bandwidth and slew rate.

The TSV621 presents a high tolerance to ESD, sustaining 4 kV for the human body model.

Additionally, the TSV621 is offered in SC70-5 and SOT23-5 micropackages, with extended temperature ranges from -40° C to +125° C.

All these features make the TSV621 ideal for sensor interfaces, battery-supplied and portable applications, as well as active filtering.

所有功能
4 kV HBM

Extended temperature range: -40 to +125° C

Micropackages: SC70-5, SOT23-5

Unity gain stability

Low supply voltage: 1.5 V–5.5V

Low input offset voltage: 800 µV max (A version)

Rail-to-rail input and output

Gain bandwidth product: 420 kHz typ

Low input bias current: 1 pA typ

Low power consumption: 29 µA typ
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eDesignSuite

eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.

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Power Supply Design Tool

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Power Management Design Center

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Power Management Design Center

Digital Power Workbench

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• Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs

Power Management Design Center

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STPOWER Studio

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Thermal-electrical Simulators for Components

Twister Sim

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• Supports various PCB configurations

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TVS Simulator

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Estimate

• Build simple schematics and firmware inputs in minutes

• Quickly generate reliable estimates of battery life, system power consumption and bill of materials costs

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Signal Conditioning Design Tool

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Signal Conditioning Design Tool

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Signal Conditioning Design Tool

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Signal Conditioning Design Tool

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• The tool returns link budget estimate

NFC/RFID Calculators

NFC Tuning Circuit

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EDA符号、封装和3D模型

质量与可靠性

产品型号	Marketing Status	包	等级规格	符合RoHS级别	材料声明**
TSV621AICT	批量生产	SC70-5	工业	Ecopack3	PDF XML
TSV621AILT	批量生产	SOT23-5L	工业	Ecopack3	PDF XML

TSV621AICT

Package:

SC70-5

Material Declaration**:

TSV621AILT

Package:

SOT23-5L

Material Declaration**:

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系销售支持。

样片和购买

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经销商的可用性 TSV621AICT

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经销商的可用性 TSV621AILT

代理商名称	地区	库存	最小订购量	第三方链接

代理商库存报告日期:

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TSV621AICT 批量生产

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包:

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TSV621AILT 批量生产

Budgetary Price (US$)*/Qty:

-

Available at distributors

无法联系到经销商，请联系我们的销售办事处

Buy Direct at ST

Add Free Sample

包:

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RoHS:

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(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处或我们的经销商。

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