产品概要
描述
意法半导体的BALF-CC26-05D3是一款超微型巴伦，集成有匹配网络和谐波滤波器。
对匹配阻抗进行了定制，使其适用于TI CC26xx系列5x5 SimpleLink™多标准无线MCU。
该器件在非导电玻璃基板上采用意法半导体的IPD技术，优化了射频性能。
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性能一览
- 集成有匹配网络的2.45 GHz巴伦
- 匹配优化后适用于CC26系列5×5外部差分
- 低插入损耗
- 低幅度失衡
- 低相位失衡
- 基于玻璃的涂层倒装片
- 尺寸小巧，低于1.5 mm²
EDA Symbols, Footprints and 3D Models
STMicroelectronics - BALF-CC26-05D3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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Symbols
Footprints
3D models
所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
|---|
CAD Symbol & Footprint models (2)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 07 Jun 2021 | 07 Jun 2021 | |||
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| BALF-CC26-05D3 | NRND 不推荐用于新设计。量产仅供支持现有生产。 | Chip Scale Package 0.4mm pitch | Industrial | Ecopack2 | - | - |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | Minimum Sellable Quantity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BALF-CC26-05D3 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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BALF-CC26-05D3 NRND
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distributors
无法联系到经销商，请联系我们的销售办事处
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