产品概述
描述
Packaged in an insulated TO-220FPAB, this device offers high thermal performance during operation of up to 20 ARMS, thanks to a junction temperature of up to 150 °C.
This insulated fullpack package allows a back to back configuration.
The combination of noise immunity and low gate triggering current allows to design strong and compact control circuit.
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所有功能
- High junction temperature: Tj = 150 °C
- High noise immunity dV/dt = 400 V/µs up to 150 °C
- Gate triggering current IGT = 10 mA
- Peak off-state voltage VDRM/VRRM = 600 V
- High turn-on current rise dI/dt = 100 A/µs
- ECOPACK®2 compliant component
- TO-220FPAB insulated package:
- Complies with UL standards (File ref: E81734)
- Insulated voltage: 2000 VRMS
EDA符号、封装和3D模型
意法半导体 - TN2010H-6FP
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符号
封装
3D模型
所有资源
| 资源标题 | 版本 | 更新时间 |
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SPICE models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 7.0 | 06 Jun 2023 | 06 Jun 2023 |