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STPAY-TOPAZ-X1

批量生产
Design Win

Dual interface Banking SoC supporting Visa, MasterCard payment applications and FIDO user authentication

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产品概述

描述

The STPay-Topaz-X1 is a GlobalPlatform® 2.3.1 Java® Card platform for payment applications, based on the 40 nm flash technology with up to 150 Kbytes of user non-volatile memory.

The STPay-Topaz-X1 can be configured to support VISA® VSDC 2.9.2 and MasterCard® M/Chip® Advance 1.2.3 payment applications. It also supports an authenticator certified implementation compliant to FIDO2 specifications from FIDO Alliance.

The STPay system-on-chip solution is a family of products that come ready for embedding in smartcards and loaded with payment applications that run on certified Java® Card platforms. They meet all required security and payment-scheme certifications.

For detailed configuration data, contact your local ST sales office.

Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Java is a registered trademark of Oracle and/or its affiliates.

  • 所有功能

      • 40 nm flash technology
      • Java® Card platform
      • Up to 150 Kbytes of user NVM
      • Certified payment applications: VISA® and MasterCard®
      • FIDO2 authenticator application
    • Platform
      • Java® Card 3.0.5 classic operating system
      • GlobalPlatform® 2.3.1 financial configuration 1.0.2 API support
      • Common personalization specification (CPS)-compliant
      • ISO/IEC 7816 T = 0 or T = 1 contact protocol
      • ISO/IEC 14443 Type A contactless interface
    • Hardware
      • ST31N600 product based on a 32-bit Arm® SecurCore® SC000™ RISC core
      • Advanced 40 nm flash technology
      • Best-in-class RF performance
    • Cryptography
      • NESCRYPT cryptographic RSA coprocessor
      • Enhanced DES accelerator (EDES)
    • Personalization
      • Enhanced personalization performance for very fast personalization
      • EMV® CPS v1.1 compliant
      • VISA® smart debit/credit (VSDC) Personalization Specification v2.0
      • M/Chip® Advance 1.2.3 Common Personalization Specification

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EDA符号、封装和3D模型

意法半导体 - STPAY-TOPAZ-X1

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质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 Longevity Commitment Longevity Starting Date 材料声明**
STPAY-TOPAZ-X1
批量生产
SAWN WAFER F 8 工业 N/A - -

STPAY-TOPAZ-X1

Package:

SAWN WAFER F 8

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

SAWN WAFER F 8

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
供货状态
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Order from distributors
包装类型
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Country of Origin
ECCN (US)
ECCN (EU)
STPAY-TOPAZ-X1
Available at distributors

经销商的可用性 STPAY-TOPAZ-X1

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STPAY-TOPAZ-X1 批量生产

Budgetary Price (US$)*/Qty:
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RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STPAY-TOPAZ-X1

代理商名称

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商