产品概述
描述
The STPay-Topaz-1 is a GlobalPlatform® 2.2.1 Java® Card platform for payment and loyalty applications, based on the 40 nm flash technology with up to 110 Kbytes of user non-volatile memory.
The STPay-Topaz-1 can be configured to support VISA®, VISA® VSDC 2.9.2, VSDC 2.9.1 or 2.8.1g1, MasterCard® M/Chip® Advance 1.2.3, Interac® Flash 1.7, Discover® D-PAS Connect 2.1, Discover® D-PAS 1.1, AMEX® AEIPS 4.4, JCB® D.1.1 or D.1.2, qSPARC 2.0, Elo 1.5.3.g EMV® payment applications. It also supports the L-applet for loyalty, membership and frequent traveler applications.
The STPay-Topaz-1 is also available as a Java virtual machine (JVM) platform, providing 200 Kbytes of non-volatile memory for customer applets.
The STPay system-on-chip solution is a family of products that come ready for embedding in smartcards and loaded with payment applications that run on certified Java® Card platforms. They meet all required security and payment-scheme certifications.
For detailed configuration data, contact your local ST sales office.
Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
Java is a registered trademark of Oracle and/or its affiliates.
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所有功能
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- 40 nm flash technology
- Java® Card platform
- Up to 110 Kbytes of user NVM
- Certified payment applications: VISA®, MasterCard®, Interac® Flash, Discover®, AMEX®, JCB®, RuPay®, and Elo
- Common Personalization Specification (CPS) personalization
- SDA/DDA support
- Platform
- Java® Card 3.0.5 classic operating system
- GlobalPlatform® 2.2.1 MG 1.0.1 API support
- CPS-compliant
- ISO/IEC 7816 T = 0 or T = 1 contact protocol
- ISO/IEC 14443 Type A contactless interface
- Hardware
- ST31P450 product based on a 32-bit Arm® SecurCore® SC000™ RISC core
- Advanced 40 nm flash technology
- Best-in-class RF performance
- Cryptography
- NESCRYPT cryptographic RSA coprocessor
- Enhanced DES accelerator (EDES)
- Personalization
- Enhanced personalization performance for very fast personalization
- EMV® CPS v1.1 compliant
- VISA® smart debit/credit (VSDC) Personalization Specification v2.0
- M/Chip® Advance 1.2.3 Common Personalization Specification
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EDA符号、封装和3D模型
意法半导体 - STPay-Topaz-1
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| STPAY-TOPAZ-1 | 批量生产 | DICE | 工业 | N/A | - | - | |
STPAY-TOPAZ-1
Package:
DICEMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STPAY-TOPAZ-1 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
STPAY-TOPAZ-1 批量生产