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STPay-Sapphire-1

批量生产
Design Win

Contact Banking SoC supporting broad range of payment applications

下载数据摘要

产品概述

描述

The STPay-Sapphire-1 is a GlobalPlatform 2.2.1 Java Card platform for payment and loyalty applications, based on the 40 nm Flash technology and up to 60 Kbytes of user non-volatile memory.

The STPay-Sapphire-1 can be configured to support VISA VSDC 2.9.1 or 2.8.1g1, MasterCard M/Chip Advance 1.2.3, Interac Flash 1.6, Discover 1.1, AMEX AEIPS 4.4 and JCB D.1.1 EMV payment applications.

The STPay system-on-chip solution is a family of products that come ready for embedding in smartcards and loaded with payment applications that run on certified Java Card platforms. They meet all required security and payment-scheme certifications.

For detailed configuration data, contact your local ST sales office.

  • 所有功能

      • 40 nm Flash technology
      • Java Card™ platform
      • Up to 60 Kbytes of user NVM
      • Certified payment applications: VISA, MasterCard, Interac Flash, Discover, AMEX and JCB
      • Common Personalization Specification (CPS) personalization
    • Platform
      • Java Card 3.0.5 classic operating system
      • GlobalPlatform® 2.2.1 MG 1.0.1 API support
      • CPS-compliant
      • ISO/IEC 7816 T = 0 or T = 1 contact protocol
    • Hardware
      • ST31 product based on a 32-bit Arm® SecurCore® SC000™ RISC core
      • Advanced 40 nm Flash technology
      • Best-in-class RF performance
      • Up to 60 Kbytes of user non-volatile memory
    • Cryptography
      • NESCRYPT cryptographic RSA coprocessor
      • Enhanced DES accelerator (EDES)
    • Personalization
      • Enhanced personalization performance for very fast personalization
      • EMV® CPS v1.1 compliant
      • VISA smart debit/credit (VSDC) Personalization Specification v2.0
      • M/Chip Advance 1.2.3 Common Personalization Specification

EDA符号、封装和3D模型

意法半导体 - STPay-Sapphire-1

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Please select one model supplier :

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 等级规格 符合RoHS级别 Longevity Commitment Longevity Starting Date 材料声明**
STPAY-SAPPHIRE-1
批量生产
DICE 工业 N/A - -

STPAY-SAPPHIRE-1

Package:

DICE

Material Declaration**:

Marketing Status

批量生产

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
供货状态
Budgetary Price (US$)*/Qty
从ST订购
Order from distributors
包装类型
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
STPAY-SAPPHIRE-1
Available at distributors

经销商的可用性 STPAY-SAPPHIRE-1

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处

STPAY-SAPPHIRE-1 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

STPAY-SAPPHIRE-1

代理商名称

代理商库存报告日期:

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商