产品概述
描述
The STeID Java is a complete solution targeting the Identity and eGovernment markets, and possibly other projects requiring a high-end Java Card OS platform on a smartcard IC. It is developed on the secure microcontroller ST31N600 and includes:
- STeID JC Open OS, which is based on an open Java multi-application platform,
- and a set of Java applets dedicated to the ID market.
The STeID Java is enabled with Java Card technology allowing multiple applications to run on a single card and provides features for secure interoperability of applications. It also provides a secure framework for the execution of the Java Card programs and data access management (via firewall).
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所有功能
- Operating system
- Open Java Card™ operating system
- Java Card™ 3.0.5
- Global platform 2.3.1
- Cryptographic support (DES, AES, RSA, EC)
- Biometric Java Card™ API
- Post-issuance
- Match-on-card support
- Certified CC EAL 6+ (ongoing)
- Java Card applets
- eMRTD applet supporting
- Basic Access Control (BAC)
- Extended Access Control (EAC)
- Password Authenticated Connection Establishment (PACE)
- ePKI applet with Key generation and Key import
- All applets to be CC certified
- Key hardware features
- Dual Core 32-bit ARM® SecurCore® SC000™
- RSA, EC, AES, and DES coprocessors
- AIS-31 class PTG.2 compliant true random number generator (TRNG)
- ISO 7816 and ISO 14443 with best-in-class RF performance
- Data retention >25 years
- Endurance (erase/write cycling) >500 K cycles
- Certified CC EAL 6+
- Operating system
EDA符号、封装和3D模型
意法半导体 - STeID-Java
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| STEID-JAVA | 批量生产 | DICE | 工业 | N/A | - | - | |
STEID-JAVA
Package:
DICEMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STEID-JAVA | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
STEID-JAVA 批量生产