ST33TPHF2XSPI

批量生产
Design Win

Long-term evolution TPM 2.0 device with an SPI interface

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产品概述

  • 所有功能

    • TPM features
      • Flash-memory-based trusted platform module (TPM)
      • Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 159 – errata 1.1 and TCG PC Client Specific TPM Platform Specifications 1.05 rev 14
      • Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
      • SP800-193 compliant for protection, detection and recovery requirements
      • Targeted certifications:
        • CC according to TPM 2.0 PP at EAL4+ (augmented with AVA_VAN.5 and ALC_FLR.1)
        • FIPS 140-2 level 2 (physical security level 3)
        • TCG certification
      • SPI support at up to 33 MHz
    • Hardware features
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD protection up to 4 kV (HBM) and 750 V (CDM)
      • 1.8 V or 3.3 V supply voltage range
    • Security features
      • Active shield and environmental sensors
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS SP800-90A and AIS20-compliant deterministic random-bit generator (DRBG)
      • FIPS SP800-90B and AIS31-compliant true random-number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024, 2048 or 3072 bits)
        • RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
        • RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
        • SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
        • HMAC SHA-1, SHA-2, and SHA-3
        • AES-128, 192, and 256 bits
        • TDES 192 bits
        • ECC (NIST P-256, P-384 curves): key generation, ECDH, and ECDSA, ECSchnorr
        • ECDAA (BN-256 curve)
      • Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
      • Device provisioned with three 2048-bit RSA key pairs to reduce the TPM provisioning time
    • Product compliance
      • Compliant with Microsoft® Windows® 10 and 11
      • Compliant with Linux® drivers
      • Compliant with Intel® vPro® technology
      • Compliant with the TCG test suite for TPM 2.0
      • Compliant with the open-source TCG TPM 2.0 TSS implementation

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EDA符号、封装和3D模型

STMicroelectronics - ST33TPHF2XSPI

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质量与可靠性

产品型号 Marketing Status 符合RoHS级别 材料声明**
ST33HTPH2X32AHD4
批量生产
VFQFPN 32 5x5x1.0 mm Ecopack2
ST33HTPH2X32AHD8
批量生产
VFQFPN 32 5x5x1.0 mm Ecopack2

ST33HTPH2X32AHD4

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFQFPN 32 5x5x1.0 mm

RoHS Compliance Grade

Ecopack2

ST33HTPH2X32AHD8

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFQFPN 32 5x5x1.0 mm

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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ST33HTPH2X32AHD4
Available at distributors

经销商的可用性 ST33HTPH2X32AHD4

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ST33HTPH2X32AHD8
Available at distributors

经销商的可用性 ST33HTPH2X32AHD8

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ST33HTPH2X32AHD4 批量生产

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RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

ST33HTPH2X32AHD4

Operating Temperature (°C)

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ST33HTPH2X32AHD8 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

ST33HTPH2X32AHD8

Operating Temperature (°C)

Min:

Max:

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商