产品概述
描述
The Smart ResetTMdevices provide a useful feature which ensures that inadvertent short reset push-button closures do not cause system resets. This is done by implementing an extended Smart Reset input delay time (tSRC), which ensures a safe reset and eliminates the need for a specific dedicated reset button.
This reset configuration provides versatility and allows the application to distinguish between a software generated interrupt and a hard system reset. When the input push-button is connected to the microcontroller interrupt input, and is closed for a short time, the processor can only be interrupted. If the system still does not respond properly, continuing to keep the push-button closed for the extended setup time tSRCcauses a hard reset of the processor through the reset output.
The SR1 has one Smart Reset input (SR) with preset delayed Smart Reset setup time (tSRC). The reset output (RST) is asserted after the Smart Reset input is held active for the selected tSRCdelay time. The RSToutput remains asserted either until the SRinput goes to inactive logic level (i.e. neither fixed nor minimum reset pulse width is set) or the output reset pulse duration is fixed for tREC(i.e. factory-programmed). The device fully operates over a broad VCCrange from 2.0 V to 5.5 V.
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所有功能
- Operating voltage range 2 V to 5.5 V
- Low supply current 1 μA
- Integrated test mode
- Single Smart Reset™ push-button input with fixed extended reset setup delay (tSRC) from 0.5 s to 10 s in 0.5 s steps (typ.), option with internal input pull-up resistor
- Push-button controlled reset pulse duration
- Option 1: fully push-button controlled, no fixed or minimum pulse width guaranteed
- Option 2: defined output reset pulse duration (tREC), factory-programmed
- Single reset output
- Active low or active high
- Push-pull or open drain with optional pull-up resistor
- Fixed Smart Reset input logic voltage levels
- Operating temperature: -40 °C to +85 °C
- UDFN6 package 1.00 mm x 1.45 mm
- ECOPACK®2 (RoHS compliant, Halogen-Free)
EDA符号、封装和3D模型
意法半导体 - SR1
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| SR1CARU | 批量生产 | UFDFPN 1X1.45X0.6 6L PITCH0.5 | 工业 | Ecopack3 | - | - | |
| SR1HARU | 批量生产 | UFDFPN 1X1.45X0.6 6L PITCH0.5 | 工业 | Ecopack3 | - | - | |
| SR1LARU | 批量生产 | UFDFPN 1X1.45X0.6 6L PITCH0.5 | 工业 | Ecopack3 | - | - | |
| SR1PAAU | 批量生产 | UFDFPN 1X1.45X0.6 6L PITCH0.5 | 工业 | Ecopack3 | - | - | |
| SR1PARU | 批量生产 | UFDFPN 1X1.45X0.6 6L PITCH0.5 | 工业 | Ecopack3 | - | - | |
| SR1PBBU | 批量生产 | UFDFPN 1X1.45X0.6 6L PITCH0.5 | 工业 | Ecopack3 | - | - | |
SR1PBBU
Package:
UFDFPN 1X1.45X0.6 6L PITCH0.5Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | Reset pulse width (mS) (min) | Reset pulse width (mS) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||||
| SR1PBBU | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| SR1HARU | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| SR1CARU | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| SR1PARU | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| SR1PAAU | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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| SR1LARU | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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SR1PBBU 批量生产
SR1HARU 批量生产
SR1CARU 批量生产
SR1PARU 批量生产
SR1PAAU 批量生产
SR1LARU 批量生产