产品概述
描述
The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports.
The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV on external contacts.
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所有功能
- 2-line, low-pass filter + 2-line ESD protection
- High efficiency in EMI filtering
- Lead-free package
- Very low PCB space occupation: < 2.80 mm
- Very thin package: 0.65 mm
- High efficiency in ESD suppression (IEC 61000-4-2 level 4)
- High reliability offered by monolithic integration
- High reduction of parasitic elements through integration and wafer level packaging
EDA符号、封装和3D模型
意法半导体 - EMIF02-USB03F2
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
所有资源
| 资源标题 | 版本 | 更新时间 |
|---|
CAD Symbol & Footprint models (2)
| 资源标题 | 版本 | 更新时间 | |||
|---|---|---|---|---|---|
| ZIP | 1.0 | 11 Jun 2021 | 11 Jun 2021 | ||
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
质量与可靠性
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样片和购买
| 料号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EMIF02-USB03F2 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
EMIF02-USB03F2 NRND