产品概述
描述
The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.
The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device.
Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.
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所有功能
- Packaged in lead-free Flip Chip
- Very low resistance: 0.35 Ω
- High attenuation: -45 dB at 900 MHz
- Very low PCB space consumption:0.89 mm x 1.26 mm
- Very thin package: 0.65 mm
- High efficiency in ESD suppressionIEC6 1000-4-2 level 4
- High reliability offered by monolithic integration
- High reduction of parasitic elements through integration and wafer level packaging
- Complies with the following standards
- IEC 61000-4-2 level 4:
- ±15 kV (air discharge)
- ±8 kV (contact discharge)
- IEC 61000-4-2 level 4:
EDA符号、封装和3D模型
所有资源
| 资源标题 | 版本 | 更新时间 |
|---|
硬件型号 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 01 Aug 2015 | 01 Aug 2015 |
CAD Symbol & Footprint models (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.1 | 11 Jun 2021 | 11 Jun 2021 | |
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| EMIF02-SPK02F2 | NRND | CSP P 0.5 mm | 工业 | Ecopack2 | - | - |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EMIF02-SPK02F2 | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
EMIF02-SPK02F2 NRND