产品概述
描述
DSL04设计用于保护DSL2线路驱动器免受全球电信标准定义的浪涌的影响。该器件可保护用于CPE和DSLAM的线路驱动器。器件的低电容特性使其适用于从ADSL到VDSL2数据速率。
即使与降级或振荡气体管一起使用，DSL04仍能在恶劣的条件下适用。
DSL04采用SOT23-6L封装。
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所有功能
- 高抗浪涌能力，符合GR - 1089和ITU-T K20/21标准
- 电压范围：5 V至24 V
- 低电容器件: Ctyp= 1 pF
- RoHS 封装
- 低漏电流：25°C时，为0.2 μA
- 符合以下标准
- Telcordia GR-1089
- 2.5 kV 2/10 μs - 500 A 2/10 μs
- AC power fault tests
- ITU-T K20/21/44
- 6 kV 10/700 μs - 150 A 5/310 μs
- Power induction tests
- Power contact tests
- IEC 61000-4-2, level 4
- 15 kV (air discharge)
- 8 kV (contact discharge
- IEC 61000-4-5, level 2
- ±1 kV, 42 Ω
- MIL STD 883G-Method 3015-7: Class 3
- 8 kV (human body model)
- Telcordia GR-1089
EDA符号、封装和3D模型
意法半导体 - DSL04
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
所有资源
| 资源标题 | 版本 | 更新时间 |
|---|
SPICE models (1)
| 资源标题 | 版本 | 更新时间 | |||
|---|---|---|---|---|---|
| ZIP | 1.0 | 06 Jul 2020 | 06 Jul 2020 |
CAD Symbol & Footprint models (5 of 18)
| 资源标题 | 版本 | 更新时间 | |||
|---|---|---|---|---|---|
| ZIP | 1.0 | 26 May 2020 | 26 May 2020 | ||
| ZIP | 1.0 | 14 Apr 2020 | 14 Apr 2020 | ||
| ZIP | 1.0 | 26 May 2020 | 26 May 2020 | ||
| ZIP | 1.0 | 14 Apr 2020 | 14 Apr 2020 | ||
| ZIP | 1.0 | 26 May 2020 | 26 May 2020 | ||
| ZIP | 1.0 | 14 Apr 2020 | 14 Apr 2020 | ||
| ZIP | 1.0 | 26 May 2020 | 26 May 2020 | ||
| ZIP | 1.0 | 14 Apr 2020 | 14 Apr 2020 | ||
| ZIP | 1.0 | 26 May 2020 | 26 May 2020 | ||
| ZIP | 1.0 | 14 Apr 2020 | 14 Apr 2020 | ||
| ZIP | 1.0 | 26 May 2020 | 26 May 2020 | ||
| ZIP | 1.0 | 14 Apr 2020 | 14 Apr 2020 | ||
| ZIP | 1.0 | 26 May 2020 | 26 May 2020 | ||
| ZIP | 1.0 | 14 Apr 2020 | 14 Apr 2020 | ||
| ZIP | 1.0 | 26 May 2020 | 26 May 2020 | ||
| ZIP | 1.0 | 14 Apr 2020 | 14 Apr 2020 | ||
| ZIP | 1.0 | 26 May 2020 | 26 May 2020 | ||
| ZIP | 1.0 | 14 Apr 2020 | 14 Apr 2020 |