产品概述
描述
该器件将两个IGBT和二极管组成半桥拓扑，封装在一个非常紧凑、坚固且便于表面贴装的封装中。作为HB系列IGBT的一部分，该器件在传导和开关损耗方面针对软换向应用进行了优化。每个开关均集成了具有低正向压降的续流二极管。因此，该产品专为任何谐振和软开关应用而设计，能够最大化效率。
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所有功能
- 通过AQG 324认证
- 高速开关系列
- 最高结温：TJ = 175 °C
- 低VCE(sat) = 1.7 V（典型值）@ IC = 80 A
- 最小尾电流
- 参数分布紧密
- 采用DBC基板，热阻低
- VCE(sat) 正温度系数
- 超快软恢复反向并联二极管
- 隔离额定值3.4 kVrms/min
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
Power Management Design Center
Thermal-electrical Simulators for Components
Signal Conditioning Design Tool
NFC/RFID Calculators
Choose design tool: 
Power Management Design Center
Power Supply Design Tool
• SMPS design, by topology, by type and by product
• PFC design with analog and digitial control
• Supports various PCB configurations
Choose type: DC/DC AC/DC 太阳能电池充电器
Power Management Design Center
LED Lighting Design Tool
• Handles AC-DC and DC-DC design in common topologies
• Displays interactive and annotated schematic
• Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data
Choose type: DC/DC AC/DC
Power Management Design Center
Digital Power Workbench
• Provides a step-by-step optimized design of power section and control loop
• Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs
Power Management Design Center
Power Tree Designer
• Specify input/output power for each node in the tree
• Check for consistency
• Design each individual node
Choose design tool: 
Thermal-electrical Simulators for Components
AC Switches Simulator
• Select ratings and application waveforms
• Get junction temperature and blocking voltage graphs
• Search and sort suitable devices
Thermal-electrical Simulators for Components
Rectifier Diodes Simulator
• Select ratings and application waveforms
• Estimate power losses
• Search and sort suitable devices
Thermal-electrical Simulators for Components
STPOWER Studio
• Supports long mission profiles
• Provides power loss and temperature graphs
• Helps define heatsink thermal properties
Thermal-electrical Simulators for Components
Twister Sim
• Help select the right ViPOWER Automotive power device
• Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis
• Supports various PCB configurations
Thermal-electrical Simulators for Components
TVS Simulator
• Specify system ratings and surge waveform
• Search and sort suitable devices
Thermal-electrical Simulators for Components
Estimate
• Build simple schematics and firmware inputs in minutes
• Quickly generate reliable estimates of battery life, system power consumption and bill of materials costs
Thermal-electrical Simulators for Components
PCB Thermal Simulator
• Thermal analysis of a PCB from Gerber files.
• Possibility to add heat sources, heat sinks, copper areas and thermal paths.
• Powerful server-side engine for rendering and simulation.
• Thermal results shown graphically via 2D table.
Choose design tool: 
Signal Conditioning Design Tool
Active Filters
• Handles multi-stage-designs and common topologies
• Returns circuit component values
• Provides gain, phase and group delay graphs
• Low Pass, High Pass and Band Pass
Signal Conditioning Design Tool
Comparators
• Handles most common configurations
• Returns circuit components values
• Provides I/O signal waveforms
• Inverting, Non Inverting, Window
Signal Conditioning Design Tool
Low side Current Sensing
• Returns circuit component values
• Provides current error graphs
Signal Conditioning Design Tool
High side Current Sensing
• Provides current error graphs.
• Help to select the right High side current sensing and shunt devices.
Choose design tool: 
NFC/RFID Calculators
NFC Inductance
• Input geometry and substrate properties
• Get antenna impedance
NFC/RFID Calculators
UHF Link Budget
• Enter forward and reverse link characteristics
• The tool returns link budget estimate
NFC/RFID Calculators
NFC Tuning Circuit
• Enter antenna parameter and matching target
• Select the topology of the matching network
• The tool returns component values for the desired design targets
EDA符号、封装和3D模型
意法半导体 - STGSH80HB65DAG
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 一般描述 | 包 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|---|
| STGSH80HB65DAG | 批量生产 | Automotive-grade ACEPACK SMIT half-bridge topology 650 V, 80 A HB series IGBT with diode | ACEPACK SMIT | 汽车应用 | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | 一般描述 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STGSH80HB65DAG | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
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STGSH80HB65DAG 批量生产
Budgetary Price (US$)*/Qty:
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distributors
无法联系到经销商，请联系我们的销售办事处
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):
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