产品概要
描述
该系列器件为采用先进的PowerMESH技术开发的超高速IGBT。该工艺可保证在开关性能与低通态行为之间实现完美平衡。
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性能一览
- 较低的导通压降 (VCE(sat))
- 较低的Cres/Cies比率（无交叉导通易感性）
- 超快超软恢复反向并联二极管
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STGB7NC60HDT4
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
所有资源
| Resource title | 版本 | Latest update | Actions | Details | 下載 |
|---|
SPICE models (1)
| Resource title | 版本 | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 07 May 2025 | 07 May 2025 |
Quality and Reliability
| Part Number | Marketing Status | General Description | Package | Grade | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|---|
| STGB7NC60HDT4 | Active 产品已量产 | 600 V, 14 A very fast IGBT | D2PAK | Industrial | Ecopack2 | - | - |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
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Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | General Description | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||
| STGB7NC60HDT4 | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
| |||||||||||
STGB7NC60HDT4 Active
Budgetary Price (US$)*/Qty:
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distributors
无法联系到经销商，请联系我们的销售办事处
Package:
Packing Type:
RoHS:
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ECCN (US):
ECCN (EU):