产品概要
描述
MD1803DFX采用新型增强型高压结构，基于平面扩散集电极技术制造。新的MD产品系列提高了硅效率，为水平偏转级带来了更新的性能。
-
性能一览
- 符合2002/93/EC欧洲指令
- 集成续流二极管
- 先进的技术：
扩散集电极“增强型生成” - 低基极驱动要求
- 工作温度变化时性能更稳定
- 完全绝缘的电源封装，符合U.L.标准
- 在工作集电极电流下，hFE范围更严格
EDA Symbols, Footprints and 3D Models
STMicroelectronics - MD1803DFX
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| MD1803DFX | Active 产品已量产 | TO-3PF | Industrial | Ecopack1 | - | 2024-06-10T00:00:00.000+02:00 | |
MD1803DFX
Package:
TO-3PFMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
Thank you for your interest in our Partner's solution!
You’re now leaving st.com and will be re-directed to our Partner’s website.
For the latest innovations and solutions from ST, sign up for our newsletters.
Sample & Buy
| Part Number | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MD1803DFX | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
MD1803DFX Active
Budgetary Price (US$)*/Qty:
-
distributors
无法联系到经销商，请联系我们的销售办事处
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):