产品概述
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所有功能
- LOW INTERNAL PARASITIC INDUCTANCE
- EASY TO MOUNT
- HIGH CURRENT POWER BIPOLAR MODULE
- SPECIFIED ACCIDENTAL OVERLOAD AREAS
- VERY LOW Rth JUNCTION CASE
- FULLY INSULATED PACKAGE (UL COMPLIANT)
- ULTRAFAST FREEWHEELING DIODE
EDA符号、封装和3D模型
意法半导体 - ESM3030DV
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型