产品概述
描述
The BUXD87 is manufactured using High Voltage Multi Epitaxial Planar technology for high switching speeds and high voltage withstand capability.
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所有功能
- REVERSE PINS OUT Vs STANDARD IPAK/DPAK PACKAGE
- HIGH DC CURRENT GAIN
- HIGH VOLTAGE CAPABILITY
- SURFACE-MOUNTING DPAK (TO-252) POWER PACKAGE IN TAPE & REEL (SUFFIX \"T4\")
- THROUGH-HOLE IPAK (TO-251) POWER PACKAGE IN TUBE (SUFFIX \"-1\")
EDA符号、封装和3D模型
意法半导体 - BUXD87
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| BUXD87T4 | 批量生产 | DPAK | 工业 | Ecopack2 | 10 | 2024-06-10T00:00:00.000+02:00 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| BUXD87T4 | | | distributors 无法联系到经销商，请联系我们的销售办事处 | |||||||||||
BUXD87T4 批量生产
Budgetary Price (US$)*/Qty:
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distributors
无法联系到经销商，请联系我们的销售办事处
包:
包装类型:
RoHS:
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ECCN (US):
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