产品概述
描述
This power module realizes a fourpack topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.
-
所有功能
- Fourpack topology
- ACEPACK 2 power module
- 23 mΩ of typical RDS(on) each switch
- Insulation voltage 2.5 kVrms
- Integrated NTC temperature sensor
- Integrated DC link capacitor
- DBC Cu-Al2O3-Cu based
- Press-fit contact pins
您可能还会喜欢...
特别推荐
EDA符号、封装和3D模型
意法半导体 - A2F20M65W3-FC
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
样片和购买
Don't show this again
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A2F20M65W3-FC | | | distributors 无法联系到经销商，请联系我们的销售办事处 |
A2F20M65W3-FC 批量生产
Budgetary Price (US$)*/Qty:
-
distributors
无法联系到经销商，请联系我们的销售办事处
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):
Don't show this again