产品概述
描述
This power module realizes a fourpack topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.
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所有功能
- Fourpack topology
- ACEPACK 2 power module
- 23 mΩ of typical RDS(on) each switch
- Insulation voltage 2.5 kVrms
- Integrated NTC temperature sensor
- Integrated DC link capacitor
- DBC Cu-Al2O3-Cu based
- Press-fit contact pins
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特别推荐
EDA符号、封装和3D模型
质量与可靠性
| 料号 | Marketing Status | 包 | 等级规格 | 符合RoHS级别 | Longevity Commitment | Longevity Starting Date | 材料声明** |
|---|---|---|---|---|---|---|---|
| A2F20M65W3-FC | NRND 不推荐用于新设计。量产仅供支持现有生产。 | ACEPACK 2 | 工业 | Ecopack1 | - | - |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
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样片和购买
| 料号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 包 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating Temperature (°C) (min) | Operating Temperature (°C) (max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A2F20M65W3-FC | | | distributors 无法联系到经销商,请联系我们的销售办事处 |
A2F20M65W3-FC NRND