产品概述
描述
This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.
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所有功能
- ACEPACK™ 1 power module
- DBC Cu Al2O3 Cu
- Sixpack topology
- 1200 V, 25 A IGBTs and diodes
- Soft and fast recovery diode
- Integrated NTC
- ACEPACK™ 1 power module
EDA符号、封装和3D模型
意法半导体 - A1P25S12M3-F
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