栅极驱动器，Mosfet和保护电路集成到单个封装中，以驱动工业和家电应用中的负载，每平方厘米的功率密度也随之更高。
ST 的high-density power drivers 是系统级封装（SiP）解决方案，它集成了紧凑型QFN封装，STDRIVE栅极驱动器以及基于MOSFET的功率级,满足高集成度和低开发成本的工业市场趋势。
ST的高密度电源驱动器可实现高功率密度和更小的占位面积，从而为客户节省宝贵的电路板空间并降低整体材料清单（BOM）成本。还有助于缩短开发时间并消除PCB级别的EMI问题，因为这些组件已在ST工厂集成和调整,从而加快了产品上市时间。
System-in-Package Delivers Space Savings with Flexibility and Safety in High-Voltage Brushed DC Motor Applications
Complete full-bridge system-in-package includes MOSFETs, gate drivers, and protection features to save space, simplify design, and streamline assembly
The PWD13F60 System-in-Package (SiP) contains a complete 600V/8A single-phase, high-voltage, MOSFET full-bridge power driver in a 13 x 11 mm outline package, saving bill-of-materials costs and board space in industrial motor drives, lamp ballasts, power supplies, converters, and inverters.
--> BOM space and cost saving both during the design and system assembling
- 600 V full-bridge system-in-package
- Bootstrap diodes embedded inside gate drivers for reliable switching and low EMI
--> Suitable for a wide range of industrial applications
- 8 A and 320 mΩ embedded n-channel power MOSFETs
--> Easy interfacing with microcontrollers, DSP units or Hall effect sensors
- 3.3 and 15 V compatible inputs with hysteresis and pull-down resistors
--> Maximum protection
- Integrated cross-conduction and under-voltage lock-out protections
Download the flyer to learn more about this PWD13F60 System-in-Package (SiP)
