QSMP-13 is a compact, solder-down system-on-module designed for embedded applications requiring efficient integration, robust connectivity, and rapid development. Leveraging the STM32MP135 microprocessor unit, it addresses power-constrained Linux-based systems and accelerates time-to-market by offering pre-integrated components. The module’s QFN-style form factor and pin-optimized design simplify production, enhance reliability, and support scalable customization. By utilizing STM32MP135, QSMP-13 seamlessly aligns with the ST ecosystem, enabling secure, high-performance solutions for diverse embedded markets.
Features and benefits
- QFN-style solder-down module with 27 mm square footprint and 2.3 mm height
- STM32MP135 microprocessor unit featuring Arm® Cortex®-A7 core at 650 MHz
- 256 Mbytes DDR3L RAM and up to 4 Gbytes eMMC flash memory
- Secure boot, TrustZone® peripherals, and active tamper protection
- 24-bit RGB display interface for multimedia applications
- Comprehensive expansion I/O including USB, UART, I²C, SPI, PWM, SAI
- 10/100/1000 Ethernet for high-speed networking
- Pre-programmed bootloader and optional customer-specific programming
- Pin-compatible QS module family for flexible embedded designs
- Automatic pick & place assembly and easy optical inspection
- Cost-effective 2-layer base board support for simplified integration
